April 1986
Revised March 2000
DM74LS373 • DM74LS374
3-STATE Octal D-Type Transparent Latches
and Edge-Triggered Flip-Flops
General Description
Features
■ Choice of 8 latches or 8 D-type flip-flops in a single
These 8-bit registers feature totem-pole 3-STATE outputs
designed specifically for driving highly-capacitive or rela-
tively low-impedance loads. The high-impedance state and
increased high-logic level drive provide these registers with
the capability of being connected directly to and driving the
bus lines in a bus-organized system without need for inter-
face or pull-up components. They are particularly attractive
for implementing buffer registers, I/O ports, bidirectional
bus drivers, and working registers.
package
■ 3-STATE bus-driving outputs
■ Full parallel-access for loading
■ Buffered control inputs
■ P-N-P inputs reduce D-C loading on data lines
The eight latches of the DM74LS373 are transparent D-
type latches meaning that while the enable (G) is HIGH the
Q outputs will follow the data (D) inputs. When the enable
is taken LOW the output will be latched at the level of the
data that was set up.
The eight flip-flops of the DM74LS374 are edge-triggered
D-type flip flops. On the positive transition of the clock, the
Q outputs will be set to the logic states that were set up at
the D inputs.
A buffered output control input can be used to place the
eight outputs in either a normal logic state (HIGH or LOW
logic levels) or a high-impedance state. In the high-imped-
ance state the outputs neither load nor drive the bus lines
significantly.
The output control does not affect the internal operation of
the latches or flip-flops. That is, the old data can be
retained or new data can be entered even while the outputs
are OFF.
Ordering Code:
Order Number Package Number
Package Description
DM74LS373WM
DM74LS373SJ
DM74LS373N
DM74LS374WM
DM74LS374SJ
IDM29901NC
M20B
M20D
N20A
M20B
M20D
N20A
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
© 2000 Fairchild Semiconductor Corporation
DS006431
www.fairchildsemi.com