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DF3A5.6FU PDF预览

DF3A5.6FU

更新时间: 2024-11-24 04:38:55
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
3页 154K
描述
Product for Use Only as Protection against Electrostatic Discharge (ESD).

DF3A5.6FU 数据手册

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DF3A5.6FU  
TOSHIBA Diodes for Protecting against ESD Epitaxial Planar Type  
DF3A5.6FU  
Product for Use Only as Protection against Electrostatic  
Discharge (ESD).  
Unit: mm  
* This product is for protection against electrostatic discharge (ESD)  
only and is not intended for any other usage, including without  
limitation, the constant voltage diode application.  
The mounting of two devices on an ultra-compact package allows the  
number of parts and the mounting cost to be reduced.  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Power dissipation  
Symbol  
P
Rating  
Unit  
100  
125  
mW  
°C  
Junction temperature  
T
j
Storage temperature range  
T
stg  
55~125  
°C  
Note: Using continuously under heavy loads (e.g. the application of high  
temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the  
reliability significantly even if the operating conditions (i.e.  
operating temperature/current/voltage, etc.) are within the  
absolute maximum ratings.  
JEDEC  
JEITA  
TOSHIBA  
1-2P1A  
Please design the appropriate reliability upon reviewing the  
Toshiba Semiconductor Reliability Handbook (“Handling  
Precautions”/“Derating Concept and Methods”) and individual  
reliability data (i.e. reliability test report and estimated failure rate, etc).  
Weight: 0.006 g (typ.)  
Electrical Characteristics (Ta = 25°C)  
Characteristics  
Zener voltage  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
V
I
I
= 5 mA  
= 5 mA  
5.3  
5.6  
6.0  
40  
V
Ω
Z
Z
Z
Dynamic impedance  
Reverse current  
Z
Z
I
V
V
= 2.5 V  
1.0  
μA  
R
R
R
Terminal capacitance  
(between Cathode and Anode)  
C
T
= 0, f = 1 MHz  
65  
pF  
Guaranteed Level of ESD Immunity  
Test Condition  
ESD Immunity Level  
±30 kV  
IEC61000-4-2  
(Contact discharge)  
Criterion: No damage to device elements  
2007-11-01  
1

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