DAC5681Z
www.ti.com
SLLS865–AUGUST 2007
16-BIT, 1.0 GSPS 2x-4x INTERPOLATING
DIGITAL-TO-ANALOG CONVERTER (DAC)
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FEATURES
DESCRIPTION
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16-Bit Digital-to-Analog Converter (DAC)
The DAC5681Z is a 16-bit 1.0 GSPS digital-to-analog
converter (DAC) with wideband LVDS data input,
integrated 2x/4x interpolation filters, on-board clock
multiplier, and internal voltage reference. The
DAC5681Z offers superior linearity and noise
performance.
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1.0 GSPS Update Rate
16-Bit, 1.0 GSPS Input LVDS Data Bus
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8 Sample Input FIFO
On-Chip Delay Lock Loop
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High Performance
73 dBc ACLR WCDMA TM1 at 180 MHz
The DAC5681Z integrates a wideband LVDS port
with on-chip termination, providing full 1.0 GSPS data
transfer into the DAC, or half-rate data and 1/4-rate
input data can be interpolated by on-board 2x or 4x
FIR filters. Each interpolation FIR is configurable in
either Low-Pass or High-Pass mode, allowing
selection of a higher order output sectral image. An
on-chip delay lock loop (DLL) simplifies LVDS
interfacing by providing skew control for the LVDS
input data clock.
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2x-32x Clock Multiplying PLL/VCO
2x or 4x Interpolation Filters
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Stopband Transition 0.4–0.6 Fdata
Filters configurable in either Low-Pass or
High-Pass mode–allows selection or higher
order image
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On-Chip 1.2-V Reference
The current-steering architecture of the DAC5681Z
consists of a segmented array of current sinking
switches directing up to 20mA of full-scale current to
complementary output nodes. An accurate on-chip
voltage reference is temperature-compensated and
delivers a stable 1.2-V reference voltage. Optionally,
an external reference may be used.
Differential Scalable Output: 2 to 20 mA
Package: 64-Pin 9 × 9 mm QFN
APPLICATIONS
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Cellular Base Stations
Broadband Wireless Access (BWA)
WiMAX 802.16
Fixed Wireless Backhaul
Cable Modem Termination System (CMTS)
The DAC5681Z is characterized for operation over
the industrial temperature range of –40°C to 85°C
and is available in a 64-pin QFN package. The device
is pin upgradeable to the dual-channel DAC5682Z as
well as the single-channel, non-interpolating
DAC5681.
ORDERING INFORMATION
TA
ORDER CODE
DAC5681ZIRGCT
DAC5681ZIRGCR
PACKAGE DRAWING/TYPE(1) (2)(3)
TRANSPORT MEDIA
Small Tape and Reel
Large Tape and Reel
QUANTITY
250
–40°C to 85°C
RGC / 64QFN Quad Flatpack No-Lead
2000
(1) Thermal Pad Size: 7,4 mm × 7,4 mm
(2) MSL Peak Temperature: Level-3-260C-168 HR
(3) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
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Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCT PREVIEW information concerns products in the
Copyright © 2007, Texas Instruments Incorporated
formative or design phase of development. Characteristic data and
other specifications are design goals. Texas Instruments reserves
the right to change or discontinue these products without notice.