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DAC5682ZIRGC25 PDF预览

DAC5682ZIRGC25

更新时间： 2024-11-21 06:52:15
品牌 Logo 应用领域
德州仪器 - TI 转换器数模转换器PC
页数 文件大小 规格书
59页 2406K
描述
16-BIT, 1.0 GSPS 2x-4x INTERPOLATING DUAL-CHANNEL DIGITAL-TO-ANALOG CONVERTER (DAC)

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DAC5682ZIRGC25 技术参数

是否无铅：不含铅是否Rohs认证：符合
生命周期：Obsolete零件包装代码：QFN
包装说明：HVQCCN, LCC64,.35SQ,20针数：64
Reach Compliance Code：unknown风险等级：5.46
Samacsys Confidence：Samacsys Status：Released
Samacsys PartID：605507Samacsys Pin Count：65
Samacsys Part Category：Integrated CircuitSamacsys Package Category：Other
Samacsys Footprint Name：QFN50P900X900X100-65NSamacsys Released Date：2017-01-12 12:59:53
Is Samacsys：N最大模拟输出电压：4.1 V
最小模拟输出电压：2.5 V转换器类型：D/A CONVERTER
输入位码：OFFSET BINARY, 2'S COMPLEMENT BINARY输入格式：PARALLEL, WORD
JESD-30 代码：S-PQCC-N64JESD-609代码：e4
长度：9 mm湿度敏感等级：3
位数：16功能数量：1
端子数量：64最高工作温度：85 °C
最低工作温度：-40 °C封装主体材料：PLASTIC/EPOXY
封装代码：HVQCCN封装等效代码：LCC64,.35SQ,20
封装形状：SQUARE封装形式：CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度（摄氏度）：260电源：1.8,3.3 V
认证状态：Not Qualified座面最大高度：1 mm
标称安定时间 (tstl)：0.0104 µs子类别：Other Converters
标称供电电压：3.3 V表面贴装：YES
温度等级：INDUSTRIAL端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：NO LEAD端子节距：0.5 mm
端子位置：QUAD处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：9 mmBase Number Matches：1

DAC5682ZIRGC25 数据手册

 浏览型号DAC5682ZIRGC25的Datasheet PDF文件第2页浏览型号DAC5682ZIRGC25的Datasheet PDF文件第3页浏览型号DAC5682ZIRGC25的Datasheet PDF文件第4页浏览型号DAC5682ZIRGC25的Datasheet PDF文件第5页浏览型号DAC5682ZIRGC25的Datasheet PDF文件第6页浏览型号DAC5682ZIRGC25的Datasheet PDF文件第7页 
DAC5682Z  
www.ti.com ........................................................................................................................................................ SLLS853C–AUGUST 2007–REVISED JUNE 2009  
16-BIT, 1.0 GSPS 2x-4x INTERPOLATING DUAL-CHANNEL  
DIGITAL-TO-ANALOG CONVERTER (DAC)  
1
FEATURES  
DESCRIPTION  
•
•
•
16-Bit Digital-to-Analog Converter (DAC)  
1.0 GSPS Update Rate  
The DAC5682Z is a dual-channel 16-bit 1.0 GSPS  
digital-to-analog converter (DAC) with wideband  
LVDS data input, integrated 2x/4x interpolation filters,  
on-board clock multiplier and internal voltage  
reference. The DAC5682Z offers superior linearity,  
noise, crosstalk and PLL phase noise performance.  
16-Bit Wideband Input LVDS Data Bus  
–
–
8 Sample Input FIFO  
Interleaved I/Q data for Dual-DAC Mode  
•
High Performance  
73 dBc ACLR WCDMA TM1 at 180 MHz  
–
The DAC5682Z integrates a wideband LVDS port  
with on-chip termination. Full-rate input data can be  
transferred to a single DAC channel, or half-rate and  
1/4-rate input data can be interpolated by on-board  
2x or 4x FIR filters. Each interpolation FIR is  
configurable in either Low-Pass or High-Pass mode,  
allowing selection of a higher order output spectral  
image. An on-chip delay lock loop (DLL) simplifies  
LVDS interfacing by providing skew control for the  
LVDS input data clock.  
•
•
2x-32x Clock Multiplying PLL/VCO  
2x or 4x Interpolation Filters  
–
–
Stopband Transition 0.4–0.6 Fdata  
Filters Configurable in Either Low-Pass or  
High-Pass Mode  
–
Allows Selection of Higher Order Image  
•
•
•
•
Fs/4 Coarse Mixer  
On Chip 1.2 V Reference  
The DAC5682Z allows both complex or real output.  
An optional Fs/4 coarse mixer in complex mode  
provides coarse frequency upconversion and the dual  
DAC output produces a complex Hilbert Transform  
pair. An external RF quadrature modulator then  
performs the final single sideband up-conversion.  
Differential Scalable Output: 2 to 20 mA  
Package: 64-Pin 9 × 9 mm QFN  
APPLICATIONS  
•
•
•
•
•
Cellular Base Stations  
Broadband Wireless Access (BWA)  
WiMAX 802.16  
Fixed Wireless Backhaul  
Cable Modem Termination System (CMTS)  
The DAC5682Z is characterized for operation over  
the industrial temperature range of –40°C to 85°C  
and is available in a 64-pin QFN package. Other  
single-channel members of the family include the  
interpolating DAC5681Z  
DAC5681.  
and non-interpolating  
ORDERING INFORMATION  
TA  
ORDER CODE  
DAC5682ZIRGCT  
DAC5682ZIRGCR  
PACKAGE DRAWING/TYPE(1)(2)(3)  
TRANSPORT MEDIA  
Tape and Reel  
QUANTITY  
250  
RGC / 64QFN Quad Flatpack  
No-Lead  
–40°C to 85°C  
Tape and Reel  
2000  
(1) Thermal Pad Size: 7,4 mm × 7,4 mm  
(2) MSL Peak Temperature: Level-3-260C-168 HR  
(3) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2007–2009, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
 
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DAC5682ZIRGC25 替代型号

型号 品牌 替代类型 描述 数据表
DAC5682ZIRGCTG4 TI

完全替代

 16-BIT, 1.0 GSPS 2x-4x INTERPOLATING DUAL-CHANNEL DIGITAL-TO-ANALOG CONVERTER (DAC)
DAC5682ZIRGCRG4 TI

完全替代

 16-BIT, 1.0 GSPS 2x-4x INTERPOLATING DUAL-CHANNEL DIGITAL-TO-ANALOG CONVERTER (DAC)
DAC5682ZIRGCR TI

完全替代

 16-BIT, 1.0 GSPS 2x-4x INTERPOLATING DUAL-CHANNEL DIGITAL-TO-ANALOG CONVERTER (DAC)

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