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CYW312OXC PDF预览

CYW312OXC

更新时间: 2024-02-14 06:39:20
品牌 Logo 应用领域
SPECTRALINEAR /
页数 文件大小 规格书
19页 193K
描述
FTG for VIA⑩ K7 Series Chipset with Programmable Output Frequency

CYW312OXC 技术参数

是否Rohs认证: 符合生命周期:Transferred
零件包装代码:SSOP包装说明:SSOP, SSOP48,.4
针数:48Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.39.00.01
风险等级:5.51Is Samacsys:N
其他特性:ALSO REQUIRES 2.5V SUPPLYJESD-30 代码:R-PDSO-G48
JESD-609代码:e4长度:15.875 mm
湿度敏感等级:3端子数量:48
最高工作温度:70 °C最低工作温度:
最大输出时钟频率:200 MHz封装主体材料:PLASTIC/EPOXY
封装代码:SSOP封装等效代码:SSOP48,.4
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, SHRINK PITCH
峰值回流温度(摄氏度):260电源:2.5/3.3 V
主时钟/晶体标称频率:14.31818 MHz认证状态:Not Qualified
座面最大高度:2.794 mm子类别:Clock Generators
最大供电电压:3.465 V最小供电电压:3.135 V
标称供电电压:3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:GULL WING
端子节距:0.635 mm端子位置:DUAL
处于峰值回流温度下的最长时间:20宽度:7.5057 mm
uPs/uCs/外围集成电路类型:CLOCK GENERATOR, PROCESSOR SPECIFICBase Number Matches:1

CYW312OXC 数据手册

 浏览型号CYW312OXC的Datasheet PDF文件第12页浏览型号CYW312OXC的Datasheet PDF文件第13页浏览型号CYW312OXC的Datasheet PDF文件第14页浏览型号CYW312OXC的Datasheet PDF文件第16页浏览型号CYW312OXC的Datasheet PDF文件第17页浏览型号CYW312OXC的Datasheet PDF文件第18页 
W312-02  
Absolute Maximum Ratings[2]  
Stresses greater than those listed in this table may cause  
permanent damage to the device. These represent a stress  
rating only. Operation of the device at these or any other condi-  
tions above those specified in the operating sections of this  
specification is not implied. Maximum conditions for extended  
periods may affect reliability.  
.
Parameter  
VDD, VIN  
TSTG  
TB  
Description  
Voltage on any pin with respect to GND  
Storage Temperature  
Rating  
–0.5 to +7.0  
–65 to +150  
–55 to +125  
0 to +70  
Unit  
V
°C  
°C  
°C  
kV  
Ambient Temperature under Bias  
Operating Temperature  
TA  
ESDPROT  
Input ESD Protection  
2 (min.)  
DC Electrical Characteristics: TA = 0°C to +70°C, VDD = 3.3V 5% and 2.5V 5%  
Parameter  
Description  
Test Condition  
Min.  
Typ.  
Max.  
Unit  
Supply Current  
IDD  
IDD  
Logic Inputs  
3.3V Supply Current  
CPU =100 MHz  
Outputs Loaded[3]  
260  
25  
mA  
mA  
2.5V Supply Current  
CPUCS =100 MHz  
Outputs Loaded[3]  
VIL  
VIH  
IIL  
Input Low Voltage  
Input High Voltage  
Input Low Current[4]  
Input High Current[4]  
GND – 0.3  
2.0  
0.8  
VDD + 0.3  
–25  
V
V
µA  
µA  
IIH  
10  
Clock Outputs  
VOL  
VOH  
VOL  
Output Low Voltage  
Output High Voltage  
IOL = 1 mA  
50  
mV  
V
IOH = –1 mA  
3.1  
0
Output Low Voltage CPUT_CS,  
CPUC_CS,  
Termination to V pull-up  
(external)  
0.3  
V
CPUT0, CPUC0  
VOH  
Output High Voltage CPUT_CS,  
CPUC_CS,  
Termination to V pull-up  
(external)  
1.0  
1.2  
V
CPUT0, CPUC0  
IOL  
Output Low Current PCI, AGP  
VOL = 1.5V  
VOL = 1.5V  
VOL = 1.5V  
VOL = 1.5V  
VOH = 1.5V  
VOH = 1.5V  
VOH = 1.5V  
VOH = 1.5V  
70  
50  
50  
50  
70  
50  
50  
50  
110  
70  
135  
100  
100  
100  
135  
100  
100  
100  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
REF  
48 MHz  
70  
24_48 MHz  
70  
IOH  
Output High Current PCI, AGP  
110  
70  
REF  
48 MHz  
24_48 MHz  
70  
70  
Notes:  
2. Multiple Supplies: The voltage on any input or I/O pin cannot exceed the power pin during power-up. Power supply sequencing is NOT required.  
3. All clock outputs loaded with 6" 60: transmission lines with 20-pF capacitors.  
4. X1 input threshold voltage (typical) is V /2.  
DD  
Rev 1.0,November 27, 2006  
Page 15 of 19  

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