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CYD01S36V-133BBI PDF预览

CYD01S36V-133BBI

更新时间: 2024-11-05 02:58:47
品牌 Logo 应用领域
赛普拉斯 - CYPRESS /
页数 文件大小 规格书
28页 472K
描述
FLEx36 3.3V 32K/64K/128K/256K/512 x 36 Synchronous Dual-Port RAM

CYD01S36V-133BBI 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:17 X 17 MM, 1 MM PITCH, MO-192, FBGA-256
针数:256Reach Compliance Code:not_compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.92最长访问时间:4.4 ns
其他特性:PIPELINED ARCHITECTURE最大时钟频率 (fCLK):133 MHz
I/O 类型:COMMONJESD-30 代码:S-PBGA-B256
JESD-609代码:e0长度:17 mm
内存密度:1179648 bit内存集成电路类型:DUAL-PORT SRAM
内存宽度:36湿度敏感等级:3
功能数量:1端口数量:2
端子数量:256字数:32768 words
字数代码:32000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:32KX36输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:LBGA
封装等效代码:BGA256,16X16,40封装形状:SQUARE
封装形式:GRID ARRAY, LOW PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):225电源:1.8,3.3 V
认证状态:Not Qualified座面最大高度:1.7 mm
最大待机电流:0.075 A最小待机电流:3.14 V
子类别:SRAMs最大压摆率:0.3 mA
最大供电电压 (Vsup):1.9 V最小供电电压 (Vsup):1.7 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:TIN LEAD端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:30宽度:17 mm
Base Number Matches:1

CYD01S36V-133BBI 数据手册

 浏览型号CYD01S36V-133BBI的Datasheet PDF文件第2页浏览型号CYD01S36V-133BBI的Datasheet PDF文件第3页浏览型号CYD01S36V-133BBI的Datasheet PDF文件第4页浏览型号CYD01S36V-133BBI的Datasheet PDF文件第5页浏览型号CYD01S36V-133BBI的Datasheet PDF文件第6页浏览型号CYD01S36V-133BBI的Datasheet PDF文件第7页 
CYD01S36V  
CYD02S36V/CYD04S36V  
CYD09S36V/CYD18S36V  
PRELIMINARY  
TM  
FLEx36 3.3V 32K/64K/128K/256K/512 x 36  
Synchronous Dual-Port RAM  
Functional Description  
Features  
• True dual-ported memory cells that allow simultaneous  
access of the same memory location  
The FLEx36 family includes 1-Mbit, 2-Mbit, 4-Mbit, 9-Mbit and  
18-Mbit pipelined, synchronous, true dual-port static RAMs  
that are high-speed, low-power 3.3V CMOS. Two ports are  
provided, permitting independent, simultaneous access to any  
location in memory. A particular port can write to a certain  
location while another port is reading that location. The result  
of writing to the same location by more than one port at the  
same time is undefined. Registers on control, address, and  
data lines allow for minimal set-up and hold time.  
• Synchronous pipelined operation  
• Family of 1-Mbit, 2-Mbit, 4-Mbit, 9-Mbit and 18-Mbit  
devices  
• Pipelined output mode allows fast operation  
• 0.18-micron CMOS for optimum speed and power  
• High-speed clock to data access  
During a Read operation, data is registered for decreased  
cycle time. Each port contains a burst counter on the input  
address register. After externally loading the counter with the  
initial address, the counter will increment the address inter-  
nally (more details to follow). The internal Write pulse width is  
independent of the duration of the R/W input signal. The  
internal Write pulse is self-timed to allow the shortest possible  
cycle times.  
• 3.3V low power  
— Active as low as 225 mA (typ.)  
— Standby as low as 55 mA (typ.)  
• Mailbox function for message passing  
• Global master reset  
• Separate byte enables on both ports  
• Commercial and industrial temperature ranges  
• IEEE 1149.1-compatible JTAG boundary scan  
• 256-ball FBGA (1-mm pitch)  
A HIGH on CE0 or LOW on CE1 for one clock cycle will power  
down the internal circuitry to reduce the static power  
consumption. One cycle with chip enables asserted is required  
to reactivate the outputs.  
Additional features include: readback of burst-counter internal  
address value on address lines, counter-mask registers to  
control the counter wrap-around, counter interrupt (CNTINT)  
flags, readback of mask register value on address lines,  
retransmit functionality, interrupt flags for message passing,  
JTAG for boundary scan, and asynchronous Master Reset  
(MRST).  
• Counter wrap around control  
— Internal mask register controls counter wrap-around  
— Counter-interrupt flags to indicate wrap-around  
— Memory block retransmit operation  
• Counter readback on address lines  
• Mask register readback on address lines  
The CYD18S36V devices in this family has limited features.  
Please see Address Counter and Mask Register Opera-  
tions[18] on page 5 for details.  
• Dual Chip Enables on both ports for easy depth  
expansion  
Seamless Migration to Next-Generation Dual-Port Family  
• Seamless migration to next-generation dual-port family  
Cypress offers a migration path for all devices in this family to  
the next-generation devices in the Dual-Port family with a  
compatible footprint. Please contact Cypress Sales for more  
details.  
Table 1. Product Selection Guide  
Density  
1 Mbit  
(32K x 36)  
2 Mbit  
(64K x 36)  
4 Mbit  
(128K x 36)  
9 Mbit  
(256K x 36)  
18 Mbit  
(512K x 36)  
Part Number  
CYD01S36V  
CYD02S36V  
CYD04S36V  
CYD09S36V  
CYD18S36V  
Max. Speed (MHz)  
167  
4.0  
167  
4.0  
167  
4.0  
167  
4.0  
133  
5.0  
Max. Access Time – Clock to Data  
(ns)  
Typical Operating Current (mA)  
Package  
225  
225  
225  
270  
315  
256 FBGA  
256 FBGA  
256 FBGA  
256 FBGA  
256 FBGA  
(17 mm x 17 mm) (17 mm x 17 mm) (17 mm x 17 mm) (17 mm x 17 mm) (23 mm x 23 mm)  
Cypress Semiconductor Corporation  
Document #: 38-06076 Rev. *B  
3901 North First Street  
San Jose, CA 95134  
408-943-2600  
Revised January 27, 2005  

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