是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 |
针数: | 165 | Reach Compliance Code: | compliant |
ECCN代码: | 3A991.B.2.A | HTS代码: | 8542.32.00.41 |
风险等级: | 5.52 | 最长访问时间: | 0.29 ns |
其他特性: | PIPELINED ARCHITECTURE | JESD-30 代码: | R-PBGA-B165 |
JESD-609代码: | e0 | 长度: | 15 mm |
内存密度: | 75497472 bit | 内存集成电路类型: | DDR SRAM |
内存宽度: | 36 | 功能数量: | 1 |
端子数量: | 165 | 字数: | 2097152 words |
字数代码: | 2000000 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
组织: | 2MX36 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LBGA | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, LOW PROFILE | 并行/串行: | PARALLEL |
峰值回流温度(摄氏度): | 240 | 认证状态: | Not Qualified |
座面最大高度: | 1.4 mm | 最大供电电压 (Vsup): | 1.9 V |
最小供电电压 (Vsup): | 1.7 V | 标称供电电压 (Vsup): | 1.8 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 13 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
CY7C1570KV18-550BZXC | CYPRESS |
获取价格 |
72-Mbit DDR-II+ SRAM 2-Word Burst Architecture | |
CY7C1570KV18-550BZXC | INFINEON |
获取价格 |
DDR-II+ CIO | |
CY7C1570KV18-550BZXI | CYPRESS |
获取价格 |
72-Mbit DDR-II+ SRAM 2-Word Burst Architecture | |
CY7C1570KV18-550BZXI | INFINEON |
获取价格 |
DDR-II+ CIO | |
CY7C1570V18 | CYPRESS |
获取价格 |
72-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.5 Cycle Read Latency) | |
CY7C1570V18-300BZC | CYPRESS |
获取价格 |
72-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.5 Cycle Read Latency) | |
CY7C1570V18-300BZI | CYPRESS |
获取价格 |
72-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.5 Cycle Read Latency) | |
CY7C1570V18-300BZXC | CYPRESS |
获取价格 |
72-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.5 Cycle Read Latency) | |
CY7C1570V18-300BZXI | CYPRESS |
获取价格 |
72-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.5 Cycle Read Latency) | |
CY7C1570V18-333BZC | CYPRESS |
获取价格 |
72-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.5 Cycle Read Latency) |