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CY7C1570V18-300BZC PDF预览

CY7C1570V18-300BZC

更新时间: 2024-11-05 05:09:39
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器双倍数据速率
页数 文件大小 规格书
27页 1198K
描述
72-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.5 Cycle Read Latency)

CY7C1570V18-300BZC 数据手册

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CY7C1566V18  
CY7C1577V18  
CY7C1568V18  
CY7C1570V18  
72-Mbit DDR-II+ SRAM 2-Word Burst  
Architecture (2.5 Cycle Read Latency)  
Features  
Functional Description  
72-Mbit density (8M x 8, 8M x 9, 4M x 18, 2M x 36)  
300 MHz to 400 MHz clock for high bandwidth  
2-word burst for reducing address bus frequency  
The CY7C1566V18, CY7C1577V18, CY7C1568V18, and  
CY7C1570V18 are 1.8V Synchronous Pipelined SRAM  
equipped with DDR-II+ architecture. The DDR-II+ consists of an  
SRAM core with advanced synchronous peripheral circuitry.  
Addresses for read and write are latched on alternate rising  
edges of the input (K) clock. Write data is registered on the rising  
edges of both K and K. Read data is driven on the rising edges  
of both K and K. Each address location is associated with two  
8-bit words (CY7C1566V18), 9-bit words (CY7C1577V18),  
18-bit words (CY7C1568V18), or 36-bit words (CY7C1570V18)  
that burst sequentially into or out of the device.  
Double Data Rate (DDR) interfaces  
(data transferred at 800 MHz) at 400 MHz  
Read latency of 2.5 clock cycles  
Two input clocks (K and K) for precise DDR timing  
SRAM uses rising edges only  
Asynchronous inputs include output impedance matching input  
Echo clocks (CQ and CQ) simplify data capture in high speed  
systems  
(ZQ). Synchronous data outputs (Q, that share the same  
physical pins with the data inputs, D) are tightly matched to the  
two output echo clocks CQ/CQ, eliminating the need to capture  
data separately from individual DDR SRAMs in the system  
design.  
Data valid pin (QVLD) to indicate valid data on the output  
Synchronous internally self-timed writes  
[1]  
Core VDD = 1.8V ± 0.1V; IO VDDQ = 1.4V to VDD  
All synchronous inputs pass through input registers controlled by  
the K or K input clocks. All data outputs pass through output  
registers controlled by the K or K input clocks. Writes are  
conducted with on-chip synchronous self-timed write circuitry.  
HSTL inputs and Variable drive HSTL output buffers  
Available in 165-Ball FBGA package (15 x 17 x 1.4 mm)  
Offered in both Pb-free and non Pb-free packages  
JTAG 1149.1 compatible test access port  
Delay Lock Loop (DLL) for accurate data placement  
Configurations  
With Read Cycle Latency of 2.5 cycles:  
CY7C1566V18 – 8M x 8  
CY7C1577V18 – 8M x 9  
CY7C1568V18 – 4M x 18  
CY7C1570V18 – 2M x 36  
Selection Guide  
400 MHz  
400  
375 MHz  
375  
333 MHz  
333  
300 MHz  
300  
Unit  
MHz  
mA  
Maximum Operating Frequency  
Maximum Operating Current  
x8  
x9  
1400  
1400  
1400  
1400  
1300  
1300  
1300  
1300  
1200  
1200  
1200  
1200  
1100  
1100  
x18  
x36  
1100  
1100  
Note  
1. The QDR consortium specification for V  
is 1.5V + 0.1V. The Cypress QDR devices exceed the QDR consortium specification and are capable of supporting V  
DDQ  
DDQ  
= 1.4V to V  
.
DD  
Cypress Semiconductor Corporation  
Document Number: 001-06551 Rev. *D  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised August 07, 2007  

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