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CY7C1570V18-333BZXC PDF预览

CY7C1570V18-333BZXC

更新时间: 2024-11-05 05:09:39
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 存储内存集成电路静态存储器双倍数据速率时钟
页数 文件大小 规格书
27页 1198K
描述
72-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.5 Cycle Read Latency)

CY7C1570V18-333BZXC 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Obsolete零件包装代码:BGA
包装说明:LBGA, BGA165,11X15,40针数:165
Reach Compliance Code:compliantECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.27
Is Samacsys:N最长访问时间:0.45 ns
其他特性:PIPELINED ARCHITECTURE最大时钟频率 (fCLK):333 MHz
I/O 类型:COMMONJESD-30 代码:R-PBGA-B165
JESD-609代码:e1长度:17 mm
内存密度:75497472 bit内存集成电路类型:DDR SRAM
内存宽度:36湿度敏感等级:3
功能数量:1端子数量:165
字数:2097152 words字数代码:2000000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:2MX36
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:LBGA封装等效代码:BGA165,11X15,40
封装形状:RECTANGULAR封装形式:GRID ARRAY, LOW PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):260
电源:1.5/1.8,1.8 V认证状态:Not Qualified
座面最大高度:1.4 mm最小待机电流:1.7 V
子类别:SRAMs最大压摆率:1.2 mA
最大供电电压 (Vsup):1.9 V最小供电电压 (Vsup):1.7 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:20宽度:15 mm
Base Number Matches:1

CY7C1570V18-333BZXC 数据手册

 浏览型号CY7C1570V18-333BZXC的Datasheet PDF文件第2页浏览型号CY7C1570V18-333BZXC的Datasheet PDF文件第3页浏览型号CY7C1570V18-333BZXC的Datasheet PDF文件第4页浏览型号CY7C1570V18-333BZXC的Datasheet PDF文件第5页浏览型号CY7C1570V18-333BZXC的Datasheet PDF文件第6页浏览型号CY7C1570V18-333BZXC的Datasheet PDF文件第7页 
CY7C1566V18  
CY7C1577V18  
CY7C1568V18  
CY7C1570V18  
72-Mbit DDR-II+ SRAM 2-Word Burst  
Architecture (2.5 Cycle Read Latency)  
Features  
Functional Description  
72-Mbit density (8M x 8, 8M x 9, 4M x 18, 2M x 36)  
300 MHz to 400 MHz clock for high bandwidth  
2-word burst for reducing address bus frequency  
The CY7C1566V18, CY7C1577V18, CY7C1568V18, and  
CY7C1570V18 are 1.8V Synchronous Pipelined SRAM  
equipped with DDR-II+ architecture. The DDR-II+ consists of an  
SRAM core with advanced synchronous peripheral circuitry.  
Addresses for read and write are latched on alternate rising  
edges of the input (K) clock. Write data is registered on the rising  
edges of both K and K. Read data is driven on the rising edges  
of both K and K. Each address location is associated with two  
8-bit words (CY7C1566V18), 9-bit words (CY7C1577V18),  
18-bit words (CY7C1568V18), or 36-bit words (CY7C1570V18)  
that burst sequentially into or out of the device.  
Double Data Rate (DDR) interfaces  
(data transferred at 800 MHz) at 400 MHz  
Read latency of 2.5 clock cycles  
Two input clocks (K and K) for precise DDR timing  
SRAM uses rising edges only  
Asynchronous inputs include output impedance matching input  
Echo clocks (CQ and CQ) simplify data capture in high speed  
systems  
(ZQ). Synchronous data outputs (Q, that share the same  
physical pins with the data inputs, D) are tightly matched to the  
two output echo clocks CQ/CQ, eliminating the need to capture  
data separately from individual DDR SRAMs in the system  
design.  
Data valid pin (QVLD) to indicate valid data on the output  
Synchronous internally self-timed writes  
[1]  
Core VDD = 1.8V ± 0.1V; IO VDDQ = 1.4V to VDD  
All synchronous inputs pass through input registers controlled by  
the K or K input clocks. All data outputs pass through output  
registers controlled by the K or K input clocks. Writes are  
conducted with on-chip synchronous self-timed write circuitry.  
HSTL inputs and Variable drive HSTL output buffers  
Available in 165-Ball FBGA package (15 x 17 x 1.4 mm)  
Offered in both Pb-free and non Pb-free packages  
JTAG 1149.1 compatible test access port  
Delay Lock Loop (DLL) for accurate data placement  
Configurations  
With Read Cycle Latency of 2.5 cycles:  
CY7C1566V18 – 8M x 8  
CY7C1577V18 – 8M x 9  
CY7C1568V18 – 4M x 18  
CY7C1570V18 – 2M x 36  
Selection Guide  
400 MHz  
400  
375 MHz  
375  
333 MHz  
333  
300 MHz  
300  
Unit  
MHz  
mA  
Maximum Operating Frequency  
Maximum Operating Current  
x8  
x9  
1400  
1400  
1400  
1400  
1300  
1300  
1300  
1300  
1200  
1200  
1200  
1200  
1100  
1100  
x18  
x36  
1100  
1100  
Note  
1. The QDR consortium specification for V  
is 1.5V + 0.1V. The Cypress QDR devices exceed the QDR consortium specification and are capable of supporting V  
DDQ  
DDQ  
= 1.4V to V  
.
DD  
Cypress Semiconductor Corporation  
Document Number: 001-06551 Rev. *D  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised August 07, 2007  

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