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CY7C1512KV18-300BZC PDF预览

CY7C1512KV18-300BZC

更新时间: 2024-11-29 06:51:43
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
30页 815K
描述
72-Mbit QDR-II SRAM 2-Word Burst Architecture

CY7C1512KV18-300BZC 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active零件包装代码:BGA
包装说明:LBGA, BGA165,11X15,40针数:165
Reach Compliance Code:compliantECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41Factory Lead Time:1 week
风险等级:1.64最长访问时间:0.45 ns
其他特性:PIPELINED ARCHITECTURE; IT ALSO OPERATES AT 1.5V最大时钟频率 (fCLK):300 MHz
I/O 类型:SEPARATEJESD-30 代码:R-PBGA-B165
JESD-609代码:e0长度:15 mm
内存密度:75497472 bit内存集成电路类型:QDR SRAM
内存宽度:18湿度敏感等级:3
功能数量:1端子数量:165
字数:4194304 words字数代码:4000000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:4MX18
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:LBGA封装等效代码:BGA165,11X15,40
封装形状:RECTANGULAR封装形式:GRID ARRAY, LOW PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):235
电源:1.5/1.8,1.8 V认证状态:Not Qualified
座面最大高度:1.4 mm最小待机电流:1.7 V
子类别:SRAMs最大压摆率:0.75 mA
最大供电电压 (Vsup):1.9 V最小供电电压 (Vsup):1.7 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:20宽度:13 mm
Base Number Matches:1

CY7C1512KV18-300BZC 数据手册

 浏览型号CY7C1512KV18-300BZC的Datasheet PDF文件第2页浏览型号CY7C1512KV18-300BZC的Datasheet PDF文件第3页浏览型号CY7C1512KV18-300BZC的Datasheet PDF文件第4页浏览型号CY7C1512KV18-300BZC的Datasheet PDF文件第5页浏览型号CY7C1512KV18-300BZC的Datasheet PDF文件第6页浏览型号CY7C1512KV18-300BZC的Datasheet PDF文件第7页 
CY7C1510KV18, CY7C1525KV18  
CY7C1512KV18, CY7C1514KV18  
72-Mbit QDR™-II SRAM 2-Word  
Burst Architecture  
Features  
Configurations  
Separate Independent Read and Write Data Ports  
Supports concurrent transactions  
CY7C1510KV18 – 8M x 8  
CY7C1525KV18 – 8M x 9  
CY7C1512KV18 – 4M x 18  
CY7C1514KV18 – 2M x 36  
333 MHz Clock for High Bandwidth  
2-word Burst on all Accesses  
Double Data Rate (DDR) Interfaces on both Read and Write  
Ports (data transferred at 666 MHz) at 333 MHz  
Functional Description  
The CY7C1510KV18, CY7C1525KV18, CY7C1512KV18, and  
CY7C1514KV18 are 1.8V Synchronous Pipelined SRAMs,  
equipped with QDR-II architecture. QDR-II architecture consists  
of two separate ports: the read port and the write port to access  
the memory array. The read port has dedicated data outputs to  
support read operations and the write port has dedicated data  
inputs to support write operations. QDR-II architecture has  
separate data inputs and data outputs to completely eliminate  
the need to “turnaround” the data bus that exists with common  
I/O devices. Access to each port is through a common address  
bus. Addresses for read and write addresses are latched on  
alternate rising edges of the input (K) clock. Accesses to the  
QDR-II read and write ports are completely independent of one  
another. To maximize data throughput, both read and write ports  
are equipped with DDR interfaces. Each address location is  
associated with two 8-bit words (CY7C1510KV18), 9-bit words  
(CY7C1525KV18), 18-bit words (CY7C1512KV18), or 36-bit  
words (CY7C1514KV18) that burst sequentially into or out of the  
device. Because data can be transferred into and out of the  
device on every rising edge of both input clocks (K and K and C  
and C), memory bandwidth is maximized while simplifying  
system design by eliminating bus turnarounds.  
Two Input Clocks (K and K) for precise DDR timing  
SRAM uses rising edges only  
Two Input Clocks for Output Data (C and C) to minimize Clock  
Skew and Flight Time mismatches  
Echo Clocks (CQ and CQ) simplify Data Capture in High Speed  
Systems  
Single Multiplexed Address Input bus latches Address Inputs  
for both Read and Write Ports  
Separate Port Selects for Depth Expansion  
Synchronous internally Self-timed Writes  
QDR™-II operates with 1.5 Cycle Read Latency when DOFF  
is asserted HIGH  
Operates similar to QDR-I Device with 1 Cycle Read Latency  
when DOFF is asserted LOW  
Available in x8, x9, x18, and x36 Configurations  
Full Data Coherency, providing Most Current Data  
Depth expansion is accomplished with port selects, which  
enables each port to operate independently.  
Core VDD = 1.8V (±0.1V); IO VDDQ = 1.4V to VDD  
Supports both 1.5V and 1.8V IO supply  
All synchronous inputs pass through input registers controlled by  
the K or K input clocks. All data outputs pass through output  
registers controlled by the C or C (or K or K in a single clock  
domain) input clocks. Writes are conducted with on-chip  
synchronous self-timed write circuitry.  
Available in 165-ball FBGA Package (13 x 15 x 1.4 mm)  
Offered in both Pb-free and non Pb-free Packages  
Variable Drive HSTL Output Buffers  
JTAG 1149.1 Compatible Test Access Port  
Phase Locked Loop (PLL) for Accurate Data Placement  
Table 1. Selection Guide  
Description  
333 MHz  
333  
300 MHz  
300  
250 MHz  
250  
200 MHz  
200  
167 MHz  
167  
Unit  
MHz  
mA  
Maximum Operating Frequency  
Maximum Operating Current  
x8  
x9  
790  
730  
640  
540  
480  
790  
730  
640  
540  
480  
x18  
x36  
810  
750  
650  
550  
490  
990  
910  
790  
660  
580  
Cypress Semiconductor Corporation  
Document Number: 001-00436 Rev. *E  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised March 30, 2009  
[+] Feedback  

CY7C1512KV18-300BZC 替代型号

型号 品牌 替代类型 描述 数据表
CY7C1512KV18-300BZXC CYPRESS

完全替代

72-Mbit QDR-II SRAM 2-Word Burst Architecture
IS61QDB24M18A-300M3L ISSI

功能相似

QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165

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