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CY7C1512KV18-300BZXC PDF预览

CY7C1512KV18-300BZXC

更新时间: 2024-11-30 15:18:07
品牌 Logo 应用领域
英飞凌 - INFINEON 静态存储器
页数 文件大小 规格书
35页 911K
描述
Synchronous SRAM

CY7C1512KV18-300BZXC 数据手册

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CY7C1525KV18  
CY7C1512KV18  
CY7C1514KV18  
72-Mbit QDR® II SRAM Two-Word  
Burst Architecture  
72-Mbit QDR® II SRAM Two-Word Burst Architecture  
Features  
Configurations  
Separate independent read and write data ports  
Supports concurrent transactions  
CY7C1525KV18 – 8M × 9  
CY7C1512KV18 – 4M × 18  
CY7C1514KV18 – 2M × 36  
350 MHz clock for high bandwidth  
Two-word burst on all accesses  
Functional Description  
Double data rate (DDR) interfaces on both read and write ports  
(data transferred at 700 MHz) at 350 MHz  
The CY7C1525KV18, CY7C1512KV18, and CY7C1514KV18  
are 1.8 V synchronous pipelined SRAMs, equipped with QDR II  
architecture. QDR II architecture consists of two separate ports:  
the read port and the write port to access the memory array. The  
read port has dedicated data outputs to support read operations  
and the write port has dedicated data inputs to support write  
operations. QDR II architecture has separate data inputs and  
data outputs to completely eliminate the need to “turnaround” the  
data bus that exists with common I/O devices. Access to each  
port is through a common address bus. Addresses for read and  
write addresses are latched on alternate rising edges of the input  
(K) clock. Accesses to the QDR II read and write ports are  
completely independent of one another. To maximize data  
throughput, both read and write ports are equipped with DDR  
interfaces. Each address location is associated with 9-bit words  
(CY7C1525KV18), 18-bit words (CY7C1512KV18), or 36-bit  
words (CY7C1514KV18) that burst sequentially into or out of the  
device. Because data can be transferred into and out of the  
device on every rising edge of both input clocks (K and K and C  
and C), memory bandwidth is maximized while simplifying  
system design by eliminating bus turnarounds.  
Two input clocks (K and K) for precise DDR timing  
SRAM uses rising edges only  
Two input clocks for output data (C and C) to minimize clock  
skew and flight time mismatches  
Echo clocks (CQ and CQ) simplify data capture in high speed  
systems  
Single multiplexed address input bus latches address inputs  
for both read and write ports  
Separate port selects for depth expansion  
Synchronous internally self-timed writes  
QDR® II operates with 1.5 cycle read latency when DOFF is  
asserted HIGH  
OperatessimilartoQDRIdevicewith1cyclereadlatencywhen  
DOFF is asserted LOW  
Available in × 9, × 18, and × 36 configurations  
Full data coherency, providing most current data  
Depth expansion is accomplished with port selects, which  
enables each port to operate independently.  
Core VDD = 1.8 V (±0.1 V); I/O VDDQ = 1.4 V to VDD  
Supports both 1.5 V and 1.8 V I/O supply  
All synchronous inputs pass through input registers controlled by  
the K or K input clocks. All data outputs pass through output  
registers controlled by the C or C (or K or K in a single clock  
domain) input clocks. Writes are conducted with on-chip  
synchronous self-timed write circuitry.  
Available in 165-ball fine pitch ball grid array (FBGA) package  
(13 × 15 × 1.4 mm)  
Offered in both Pb-free and non Pb-free packages  
Variable drive HSTL output buffers  
For a complete list of related documentation, click here.  
JTAG 1149.1 compatible test access port  
Phase Locked Loop (PLL) for Accurate Data Placement  
Selection Guide  
Description  
Maximum operating frequency  
Maximum operating current  
350 MHz  
350  
333 MHz  
333  
300 MHz  
300  
250 MHz Unit  
250  
640  
650  
790  
MHz  
mA  
× 9 Not Offered  
790  
730  
× 18  
840  
810  
750  
× 36 Not Offered  
990  
910  
Cypress Semiconductor Corporation  
Document Number: 001-00436 Rev. *V  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised January 19, 2018  

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