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CY7C1464AV25-200BGI PDF预览

CY7C1464AV25-200BGI

更新时间： 2024-11-16 05:09:35
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
27页 506K
描述
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL⑩ Architecture

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CY7C1464AV25-200BGI 技术参数

是否Rohs认证： 不符合生命周期：Obsolete
零件包装代码：BGA包装说明：14 X 22 MM, 1.76 MM HEIGHT, FBGA-209
针数：209Reach Compliance Code：compliant
ECCN代码：3A991.B.2.AHTS代码：8542.32.00.41
风险等级：5.92最长访问时间：3.2 ns
其他特性：PIPELINED ARCHITECTURE最大时钟频率 (fCLK)：200 MHz
I/O 类型：COMMONJESD-30 代码：R-PBGA-B209
JESD-609代码：e0长度：22 mm
内存密度：37748736 bit内存集成电路类型：ZBT SRAM
内存宽度：72功能数量：1
端子数量：209字数：524288 words
字数代码：512000工作模式：SYNCHRONOUS
最高工作温度：85 °C最低工作温度：-40 °C
组织：512KX72输出特性：3-STATE
封装主体材料：PLASTIC/EPOXY封装代码：BGA
封装等效代码：BGA209,11X19,40封装形状：RECTANGULAR
封装形式：GRID ARRAY并行/串行：PARALLEL
峰值回流温度（摄氏度）：NOT SPECIFIED电源：1.8/2.5,2.5 V
认证状态：Not Qualified座面最大高度：1.96 mm
最大待机电流：0.12 A最小待机电流：2.38 V
子类别：SRAMs最大压摆率：0.385 mA
最大供电电压 (Vsup)：2.625 V最小供电电压 (Vsup)：2.375 V
标称供电电压 (Vsup)：2.5 V表面贴装：YES
技术：CMOS温度等级：INDUSTRIAL
端子面层：Tin/Lead (Sn/Pb)端子形式：BALL
端子节距：1 mm端子位置：BOTTOM
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：14 mm
Base Number Matches：1

CY7C1464AV25-200BGI 数据手册

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CY7C1460AV25  
CY7C1462AV25  
CY7C1464AV25  
36-Mbit (1M x 36/2M x 18/512K x 72)  
Pipelined SRAM with NoBL™ Architecture  
Functional Description  
Features  
• Pin-compatible and functionally equivalent to ZBT™  
• Supports 250-MHz bus operations with zero wait states  
— Available speed grades are 250, 200 and 167 MHz  
The CY7C1460AV25/CY7C1462AV25/CY7C1464AV25 are  
2.5V, 1M x 36/2M x 18/512 x 72 Synchronous pipelined burst  
SRAMs with No Bus Latency™ (NoBL™) logic, respectively.  
They are designed to support unlimited true back-to-back  
Read/Write operations with no wait states. The  
• Internally self-timed output buffer control to eliminate  
the need to use asynchronous OE  
CY7C1460AV25/CY7C1462AV25/CY7C1464AV25  
are  
equipped with the advanced (NoBL) logic required to enable  
consecutive Read/Write operations with data being trans-  
ferred on every clock cycle. This feature dramatically improves  
the throughput of data in systems that require frequent  
• Fully registered (inputs and outputs) for pipelined  
operation  
• Byte Write capability  
• 2.5V core power supply  
Write/Read  
transitions.  
The  
CY7C1460AV25/CY7C1462AV25/CY7C1464AV25  
pin-compatible and functionally equivalent to ZBT devices.  
are  
• 2.5V/1.8V I/O power supply  
• Fast clock-to-output times  
— 2.6 ns (for 250-MHz device)  
• Clock Enable (CEN) pin to suspend operation  
• Synchronous self-timed writes  
All synchronous inputs pass through input registers controlled  
by the rising edge of the clock. All data outputs pass through  
output registers controlled by the rising edge of the clock. The  
clock input is qualified by the Clock Enable (CEN) signal,  
which when deasserted suspends operation and extends the  
previous clock cycle. Write operations are controlled by the  
Byte Write Selects (BWa–BWh for CY7C1464AV25,  
BWa–BWd for CY7C1460AV25 and BWa–BWb for  
CY7C1462AV25) and a Write Enable (WE) input. All writes are  
conducted with on-chip synchronous self-timed write circuitry.  
• CY7C1460AV25, CY7C1462AV25 available in  
JEDEC-standard lead-free 100-pin TQFP package,  
lead-free and non-lead-free 165-ball FBGA package.  
CY7C1464AV25 available in lead-free and non-lead-free  
209-ball FBGA package  
• IEEE 1149.1 JTAG-Compatible Boundary Scan  
• Burst capability—linear or interleaved burst order  
• “ZZ” Sleep Mode option and Stop Clock option  
Three synchronous Chip Enables (CE1, CE2, CE3) and an  
asynchronous Output Enable (OE) provide for easy bank  
selection and output three-state control. In order to avoid bus  
contention, the output drivers are synchronously three-stated  
during the data portion of a write sequence.  
Logic Block Diagram–CY7C1460AV25 (1M x 36)  
ADDRESS  
REGISTER 0  
A0, A1, A  
A1  
A0  
A1'  
A0'  
D1  
D0  
Q1  
Q0  
BURST  
LOGIC  
MODE  
C
ADV/LD  
C
CLK  
CEN  
WRITE ADDRESS  
REGISTER 1  
WRITE ADDRESS  
REGISTER 2  
O
O
S
U
D
A
T
U
T
P
T
P
E
N
S
U
T
U
T
ADV/LD  
A
E
WRITE REGISTRY  
AND DATA COHERENCY  
CONTROL LOGIC  
R
E
G
I
MEMORY  
ARRAY  
B
U
F
S
T
E
E
R
I
DQs  
DQP  
DQP  
DQP  
DQP  
WRITE  
DRIVERS  
BW  
BW  
a
a
b
c
d
A
M
P
b
BW  
BW  
c
S
T
E
R
S
F
d
E
R
S
S
WE  
E
E
N
G
INPUT  
REGISTER 1  
INPUT  
REGISTER 0  
E
E
OE  
READ LOGIC  
CE1  
CE2  
CE3  
SLEEP  
CONTROL  
ZZ  
Cypress Semiconductor Corporation  
Document #: 38-05354 Rev. *D  
•
198 Champion Court  
•
San Jose, CA 95134-1709  
•
408-943-2600  
Revised June 22, 2006  
[+] Feedback  
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