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CY7C1462KVE25-167BZI PDF预览

CY7C1462KVE25-167BZI

更新时间: 2024-11-17 14:56:15
品牌 Logo 应用领域
英飞凌 - INFINEON 静态存储器
页数 文件大小 规格书
24页 676K
描述
Synchronous SRAM with ECC

CY7C1462KVE25-167BZI 数据手册

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CY7C1371KV33  
CY7C1371KVE33  
CY7C1373KV33  
18-Mbit (512K × 36/1M × 18)  
Flow-Through SRAM  
with NoBL™ Architecture (With ECC)  
18-Mbit (512K  
× 36/1M × 18) Flow-through SRAM with NoBL™ Architecture (With ECC)  
Features  
Functional Description  
No Bus Latency(NoBL) architecture eliminates dead cycles  
The CY7C1371KV33/CY7C1371KVE33/CY7C1373KV33 are  
3.3 V, 512K × 36/1M × 18 synchronous flow through burst SRAM  
designed specifically to support unlimited true back-to-back  
read/write operations with no wait state insertion. The  
between write and read cycles  
Supports up to 133 MHz bus operations with zero wait states  
Data is transferred on every clock  
CY7C1371KV33/CY7C1371KVE33/CY7C1373KV33  
are  
equipped with the advanced No Bus Latency (NoBL) logic  
required to enable consecutive read/write operations with data  
being transferred on every clock cycle. This feature dramatically  
improves the throughput of data through the SRAM, especially  
in systems that require frequent write-read transitions.  
Pin-compatible and functionally equivalent to ZBT™ devices  
Internally self-timed output buffer control to eliminate the need  
to use OE  
Registered inputs for flow through operation  
Byte write capability  
All synchronous inputs pass through input registers controlled by  
the rising edge of the clock. The clock input is qualified by the  
clock enable (CEN) signal, which when deasserted suspends  
operation and extends the previous clock cycle. Maximum  
access delay from the clock rise is 6.5 ns (133 MHz device).  
3.3 V/2.5 V I/O power supply (VDDQ  
)
Fast clock-to-output times  
6.5 ns (for 133 MHz device)  
Write operations are controlled by the two or four byte write  
select (BWX) and a write enable (WE) input. All writes are  
conducted with on-chip synchronous self-timed write circuitry.  
Clock enable (CEN) pin to enable clock and suspend operation  
Synchronous self-timed writes  
Three synchronous chip enables (CE1, CE2, CE3) and an  
asynchronous output enable (OE) provide for easy bank  
selection and output tristate control. To avoid bus contention, the  
output drivers are synchronously tristated during the data portion  
of a write sequence.  
Asynchronous output enable  
Available in JEDEC-standard Pb-free 100-pin TQFP packages  
Three chip enables for simple depth expansion  
Automatic power-down feature available using ZZ mode or CE  
deselect  
Burst capability – linear or interleaved burst order  
Low standby power  
On chip Error Correction Code (ECC) to reduce Soft Error Rate  
(SER)  
Selection Guide  
Description  
Maximum access time  
133 MHz  
6.5  
100 MHz Unit  
8.5  
114  
134  
ns  
Maximum operating current  
× 18  
× 36  
129  
mA  
mA  
149  
Cypress Semiconductor Corporation  
Document Number: 001-97852 Rev. *F  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised February 8, 2018  

与CY7C1462KVE25-167BZI相关器件

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CY7C1462KVE33 CYPRESS

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36-Mbit (1M × 36/2M × 18) Pipelined SRAM wi
CY7C1462KVE33-167AXC CYPRESS

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36-Mbit (1M × 36/2M × 18) Pipelined SRAM wi
CY7C1462KVE33-167AXC INFINEON

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Synchronous SRAM with ECC
CY7C1462V25 ETC

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Memory
CY7C1462V25-167AC CYPRESS

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ZBT SRAM, 2MX18, 3.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
CY7C1462V25-167BGC CYPRESS

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ZBT SRAM, 2MX18, 3.5ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119
CY7C1462V25-167BZC CYPRESS

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ZBT SRAM, 2MX18, 3.5ns, CMOS, PBGA165, 15 X 17 MM, 1.20 MM HEIGHT, FBGA-165
CY7C1462V25-200BZC CYPRESS

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ZBT SRAM, 2MX18, 3ns, CMOS, PBGA165, 15 X 17 MM, 1.20 MM HEIGHT, FBGA-165
CY7C1462V25-250AC CYPRESS

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ZBT SRAM, 2MX18, 2.7ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
CY7C1462V25-250BGC CYPRESS

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ZBT SRAM, 2MX18, 2.7ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119