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CY7C1382DV25-167BGXC PDF预览

CY7C1382DV25-167BGXC

更新时间: 2024-09-25 20:58:51
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 时钟静态存储器内存集成电路
页数 文件大小 规格书
29页 498K
描述
Cache SRAM, 1MX18, 3.4ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, LEAD FREE, BGA-119

CY7C1382DV25-167BGXC 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:BGA
包装说明:14 X 22 MM, 2.40 MM HEIGHT, LEAD FREE, BGA-119针数:119
Reach Compliance Code:compliantECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.84
最长访问时间:3.4 ns其他特性:PIPELINED ARCHITECTURE
最大时钟频率 (fCLK):167 MHzI/O 类型:COMMON
JESD-30 代码:R-PBGA-B119JESD-609代码:e1
长度:22 mm内存密度:18874368 bit
内存集成电路类型:CACHE SRAM内存宽度:18
湿度敏感等级:3功能数量:1
端子数量:119字数:1048576 words
字数代码:1000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:1MX18输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装等效代码:BGA119,7X17,50封装形状:RECTANGULAR
封装形式:GRID ARRAY并行/串行:PARALLEL
峰值回流温度(摄氏度):260电源:2.5 V
认证状态:Not Qualified座面最大高度:2.4 mm
最大待机电流:0.07 A最小待机电流:2.38 V
子类别:SRAMs最大压摆率:0.275 mA
最大供电电压 (Vsup):2.625 V最小供电电压 (Vsup):2.375 V
标称供电电压 (Vsup):2.5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:1.27 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:20宽度:14 mm
Base Number Matches:1

CY7C1382DV25-167BGXC 数据手册

 浏览型号CY7C1382DV25-167BGXC的Datasheet PDF文件第2页浏览型号CY7C1382DV25-167BGXC的Datasheet PDF文件第3页浏览型号CY7C1382DV25-167BGXC的Datasheet PDF文件第4页浏览型号CY7C1382DV25-167BGXC的Datasheet PDF文件第5页浏览型号CY7C1382DV25-167BGXC的Datasheet PDF文件第6页浏览型号CY7C1382DV25-167BGXC的Datasheet PDF文件第7页 
CY7C1380DV25  
CY7C1382DV25  
18-Mbit (512K x 36/1M x 18)  
Pipelined SRAM  
Features  
Functional Description[1]  
• Supports bus operation up to 250 MHz  
• Available speed grades are 250, 200 and 167 MHz  
• Registered inputs and outputs for pipelined operation  
• 2.5V core power supply  
The CY7C1380DV25/CY7C1382DV25 SRAM integrates  
512K x 36 and 1M x 18 SRAM cells with advanced  
synchronous peripheral circuitry and a two-bit counter for  
internal burst operation. All synchronous inputs are gated by  
registers controlled by a positive-edge-triggered Clock Input  
(CLK). The synchronous inputs include all addresses, all data  
inputs, address-pipelining Chip Enable (CE1), depth-  
expansion Chip Enables (CE2 and CE3[2]), Burst Control  
inputs (ADSC, ADSP, and ADV), Write Enables (BWX, and  
BWE), and Global Write (GW). Asynchronous inputs include  
the Output Enable (OE) and the ZZ pin.  
• Fast clock-to-output times  
— 2.6 ns (for 250-MHz device)  
• Provide high-performance 3-1-1-1 access rate  
User-selectable burst counter supporting Intel®  
Pentium® interleaved or linear burst sequences  
Addresses and chip enables are registered at rising edge of  
clock when either Address Strobe Processor (ADSP) or  
Address Strobe Controller (ADSC) are active. Subsequent  
burst addresses can be internally generated as controlled by  
the Advance pin (ADV).  
• Separate processor and controller address strobes  
• Synchronous self-timed writes  
• Asynchronous output enable  
• Single Cycle Chip Deselect  
Address, data inputs, and write controls are registered on-chip  
to initiate a self-timed Write cycle.This part supports Byte Write  
operations (see Pin Descriptions and Truth Table for further  
details). Write cycles can be one to two or four bytes wide as  
controlled by the byte write control inputs. GW when active  
• Available in JEDEC-standard lead-free 100-pin TQFP,  
lead-free and non lead-free 119-ball BGA package and  
165-ball FBGA package  
• IEEE 1149.1 JTAG-Compatible Boundary Scan  
• “ZZ” Sleep Mode Option  
causes all bytes to be written.  
LOW  
The CY7C1380DV25/CY7C1382DV25 operates from a +2.5V  
core power supply while all outputs may operate with a +2.5  
supply. All inputs and outputs are JEDEC-standard JESD8-5-  
compatible.  
Selection Guide  
250 MHz  
2.6  
200 MHz  
3.0  
167 MHz  
3.4  
Unit  
ns  
Maximum Access Time  
Maximum Operating Current  
Maximum CMOS Standby Current  
350  
300  
275  
mA  
mA  
70  
70  
70  
Notes:  
1. For best-practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com.  
2. CE , CE are for TQFP and 165 FBGA package only. 119 BGA is offered only in 1 Chip Enable.  
3
2
Cypress Semiconductor Corporation  
Document #: 38-05546 Rev. *D  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised June 27, 2006  

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