CY7C1380DV25
CY7C1382DV25
PRELIMINARY
18-Mbit (512K x 36/1M x 18) Pipelined SRAM
Features
Functional Description[1]
• Supports bus operation up to 250 MHz
The CY7C1380DV25/CY7C1382DV25 SRAM integrates
524,288 x 36 and 1,048,576 x 18 SRAM cells with advanced
synchronous peripheral circuitry and a two-bit counter for
internal burst operation. All synchronous inputs are gated by
registers controlled by a positive-edge-triggered Clock Input
(CLK). The synchronous inputs include all addresses, all data
inputs, address-pipelining Chip Enabl[e2] (CE1), depth-
expansion Chip Enables (CE2 and CE3 ), Burst Control
inputs (ADSC, ADSP, and ADV), Write Enables (BWX, and
BWE), and Global Write (GW). Asynchronous inputs include
the Output Enable (OE) and the ZZ pin.
Addresses and chip enables are registered at rising edge of
clock when either Address Strobe Processor (ADSP) or
Address Strobe Controller (ADSC) are active. Subsequent
burst addresses can be internally generated as controlled by
the Advance pin (ADV).
• Available speed grades are 250, 225, 200,167, and
133 MHz
• Registered inputs and outputs for pipelined operation
• 2.5V core power supply
• Fast clock-to-output times
— 2.6 ns (for 250-MHz device)
— 2.8 ns (for 225-MHz device)
— 3.0 ns (for 200-MHz device)
— 3.4 ns (for 167-MHz device)
— 4.2 ns (for 133-MHz device)
• Provide high-performance 3-1-1-1 access rate
• User-selectable burst counter supporting Intel®
Address, data inputs, and write controls are registered on-chip
to initiate a self-timed Write cycle.This part supports Byte Write
operations (see Pin Descriptions and Truth Table for further
details). Write cycles can be one to two or four bytes wide as
controlled by the byte write control inputs. GW when active
Pentium® interleaved or linear burst sequences
• Separate processor and controller address strobes
• Synchronous self-timed writes
• Asynchronous output enable
causes all bytes to be written.
LOW
• Single Cycle Chip Deselect
The CY7C1380DV25/CY7C1382DV25 operates from a +2.5V
core power supply while all outputs may operate with a +2.5
supply. All inputs and outputs are JEDEC-standard JESD8-5-
compatible.
• Offered in JEDEC-standard 100-pin TQFP, 119-ball BGA
and 165-ball fBGA packages
• IEEE 1149.1 JTAG-Compatible Boundary Scan
• “ZZ” Sleep Mode Option
Selection Guide
250 MHz
225 MHz
2.8
200 MHz
3.0
167 MHz
3.4
133 MHz
4.2
Unit
ns
mA
mA
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
2.6
350
70
325
70
300
70
275
70
245
70
Shaded areas contain advance information.
Please contact your local Cypress sales representative for availability of these parts.
Notes:
1. For best-practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com.
2. CE , CE are for TQFP and 165 fBGA package only. 119 BGA is offered only in 1 Chip Enable.
3
2
Cypress Semiconductor Corporation
•
3901 North First Street
•
San Jose, CA 95134
•
408-943-2600
Document #: 38-05546 Rev. **
Revised August 12, 2004