CY7C1380DV33
CY7C1382DV33
18-Mbit (512 K × 36/1 M × 18)
Pipelined SRAM
18-Mbit (512
K × 36/1 M × 18) Pipelined SRAM
Features
Functional Description
■ Supports bus operation up to 200 MHz
■ Available speed grades is 200 MHz
■ Registered inputs and outputs for pipelined operation
■ 3.3 V core power supply
The CY7C1380DV33/CY7C1382DV33 SRAM integrates
524,288 × 36 and 1,048,576 × 18 SRAM cells with advanced
synchronous peripheral circuitry and a two-bit counter for
internal burst operation. All synchronous inputs are gated by
registers controlled by a positive edge triggered clock input
(CLK). The synchronous inputs include all addresses, all data
inputs, address-pipelining chip enable (CE1), depth-expansion
chip enables (CE2 and CE3 [1]), burst control inputs (ADSC,
ADSP, and ADV), write enables (BWX, and BWE), and global
write (GW). Asynchronous inputs include the output enable (OE)
and the ZZ pin.
■ 2.5 V or 3.3 V I/O power supply
■ Fast clock-to-output times
❐ 3 ns (for 200 MHz device)
■ Provides high performance 3-1-1-1 access rate
Addresses and chip enables are registered at rising edge of
clock when address strobe processor (ADSP) or address strobe
controller (ADSC) are active. Subsequent burst addresses can
be internally generated as they are controlled by the advance pin
(ADV).
■ User selectable burst counter supporting Intel Pentium®
interleaved or linear burst sequences
■ Separate processor and controller address strobes
■ Synchronous self-timed write
Address, data inputs, and write controls are registered on-chip
to initiate a self-timed write cycle.This part supports byte write
operations (see Pin Definitions on page 6 and Truth Table on
page 10 for further details). Write cycles can be one to two or four
bytes wide as controlled by the byte write control inputs. GW
when active LOW causes all bytes to be written.
■ Asynchronous output enable
■ Single cycle chip deselect
■ CY7C1380DV33 is available in JEDEC-standard Pb-free
100-pin TQFP and 165-ball FBGA package and
CY7C1382DV33 is available in 165-ball FBGA package
The CY7C1380DV33/CY7C1382DV33 operates from a +3.3 V
core power supply while all outputs operate with a +2.5 or +3.3 V
power supply. All inputs and outputs are JEDEC-standard and
JESD8-5-compatible.
■ IEEE 1149.1 JTAG-Compatible Boundary Scan
■ ZZ sleep mode option
For a complete list of related documentation, click here.
Selection Guide
Description
Maximum Access Time
200 MHz
3.0
167 MHz Unit
3.4
275
70
ns
Maximum Operating Current
300
mA
mA
Maximum CMOS Standby Current
70
Note
1. CE CE are for 100-pin TQFP and 165-ball FBGA packages only.
3,
2
Cypress Semiconductor Corporation
Document Number: 001-74445 Rev. *D
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
December 29, 2015