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CY7C1382F-250BZXI PDF预览

CY7C1382F-250BZXI

更新时间: 2024-09-25 13:01:11
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
30页 1186K
描述
Cache SRAM, 1MX18, 2.6ns, CMOS, PBGA165, 15 X 13 MM, 1.4 MM HEIGHT, LEAD FREE, MO-216, FBGA-165

CY7C1382F-250BZXI 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:BGA包装说明:LBGA, BGA165,11X15,40
针数:165Reach Compliance Code:compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.84最长访问时间:2.6 ns
其他特性:PIPELINED ARCHITECTURE最大时钟频率 (fCLK):250 MHz
I/O 类型:COMMONJESD-30 代码:R-PBGA-B165
JESD-609代码:e1长度:15 mm
内存密度:18874368 bit内存集成电路类型:CACHE SRAM
内存宽度:18湿度敏感等级:3
功能数量:1端子数量:165
字数:1048576 words字数代码:1000000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:1MX18
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:LBGA封装等效代码:BGA165,11X15,40
封装形状:RECTANGULAR封装形式:GRID ARRAY, LOW PROFILE
并行/串行:PARALLEL电源:2.5/3.3,3.3 V
认证状态:Not Qualified座面最大高度:1.4 mm
最大待机电流:0.07 A最小待机电流:3.14 V
子类别:SRAMs最大压摆率:0.35 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3.135 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
宽度:13 mmBase Number Matches:1

CY7C1382F-250BZXI 数据手册

 浏览型号CY7C1382F-250BZXI的Datasheet PDF文件第2页浏览型号CY7C1382F-250BZXI的Datasheet PDF文件第3页浏览型号CY7C1382F-250BZXI的Datasheet PDF文件第4页浏览型号CY7C1382F-250BZXI的Datasheet PDF文件第5页浏览型号CY7C1382F-250BZXI的Datasheet PDF文件第6页浏览型号CY7C1382F-250BZXI的Datasheet PDF文件第7页 
CY7C1380D, CY7C1380F  
CY7C1382D, CY7C1382F  
18-Mbit (512K x 36/1M x 18) Pipelined SRAM  
Features  
Functional Description [1]  
• Supports bus operation up to 250 MHz  
• Available speed grades are 250, 200, and 167 MHz  
• Registered inputs and outputs for pipelined operation  
• 3.3V core power supply  
The  
CY7C1380D/CY7C1382D/CY7C1380F/CY7C1382F  
SRAM integrates 524,288 x 36 and 1,048,576 x 18 SRAM  
cells with advanced synchronous peripheral circuitry and a  
two-bit counter for internal burst operation. All synchronous  
inputs are gated by registers controlled by a positive edge  
triggered clock input (CLK). The synchronous inputs include  
all addresses, all data inputs, address-pipelining chip enable  
(CE1), depth-expansion chip enables (CE2 and CE3 [2]), burst  
control inputs (ADSC, ADSP, and ADV), write enables (BWX,  
and BWE), and global write (GW). Asynchronous inputs  
include the output enable (OE) and the ZZ pin.  
• 2.5V or 3.3V IO power supply  
• Fast clock-to-output times  
— 2.6 ns (for 250 MHz device)  
• Provides high-performance 3-1-1-1 access rate  
• User selectable burst counter supporting Intel® Pentium®  
interleaved or linear burst sequences  
Addresses and chip enables are registered at rising edge of  
clock when address strobe processor (ADSP) or address  
strobe controller (ADSC) are active. Subsequent burst  
addresses can be internally generated as they are controlled  
by the advance pin (ADV).  
• Separate processor and controller address strobes  
• Synchronous self-timed write  
• Asynchronous output enable  
Address, data inputs, and write controls are registered on-chip  
to initiate a self-timed write cycle.This part supports byte write  
operations (see Pin Definitions on page 6 and Truth Table [4,  
5, 6, 7, 8] on page 9 for further details). Write cycles can be one  
to two or four bytes wide as controlled by the byte write control  
inputs. GW when active LOW causes all bytes to be written.  
• Single cycle chip deselect  
• CY7C1380D/CY7C1382D available in JEDEC-standard  
Pb-free 100-pin TQFP, Pb-free and non Pb-free 165-ball  
FBGA package. CY7C1380F/CY7C1382F available in  
Pb-free and non Pb-free 119-ball BGA package  
• IEEE 1149.1 JTAG-Compatible Boundary Scan  
• ZZ sleep mode option  
The  
CY7C1380D/CY7C1382D/CY7C1380F/CY7C1382F  
operates from a +3.3V core power supply while all outputs  
operate with a +2.5 or +3.3V power supply. All inputs and  
outputs are JEDEC-standard and JESD8-5-compatible.  
Selection Guide  
250 MHz  
200 MHz  
3.0  
167 MHz  
3.4  
Unit  
ns  
Maximum Access Time  
2.6  
350  
70  
Maximum Operating Current  
Maximum CMOS Standby Current  
300  
275  
mA  
mA  
70  
70  
Notes:  
1. For best practices or recommendations, please refer to the Cypress application note AN1064, SRAM System Design Guidelines on www.cypress.com.  
2. CE CE are for TQFP and 165 FBGA packages only. 119 BGA is offered only in 1 chip enable.  
3,  
2
Cypress Semiconductor Corporation  
Document #: 38-05543 Rev. *E  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised Feburary 07, 2007  

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