是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 针数: | 165 |
Reach Compliance Code: | compliant | ECCN代码: | 3A991.B.2.A |
HTS代码: | 8542.32.00.41 | 风险等级: | 5.92 |
Is Samacsys: | N | 最长访问时间: | 2.6 ns |
其他特性: | PIPELINED ARCHITECTURE | JESD-30 代码: | R-PBGA-B165 |
JESD-609代码: | e0 | 长度: | 15 mm |
内存密度: | 18874368 bit | 内存集成电路类型: | CACHE SRAM |
内存宽度: | 18 | 湿度敏感等级: | 3 |
功能数量: | 1 | 端子数量: | 165 |
字数: | 1048576 words | 字数代码: | 1000000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 70 °C |
最低工作温度: | 组织: | 1MX18 | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LBGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, LOW PROFILE |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | 220 |
认证状态: | Not Qualified | 座面最大高度: | 1.4 mm |
最大供电电压 (Vsup): | 2.625 V | 最小供电电压 (Vsup): | 2.375 V |
标称供电电压 (Vsup): | 2.5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | BALL |
端子节距: | 1 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 13 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
CY7C1382DV25-250BZI | CYPRESS |
获取价格 |
18-Mbit (512K x 36/1M x 18) Pipelined SRAM | |
CY7C1382DV25-250BZXC | CYPRESS |
获取价格 |
18-Mbit (512K x 36/1M x 18) Pipelined SRAM | |
CY7C1382DV25-250BZXI | CYPRESS |
获取价格 |
18-Mbit (512K x 36/1M x 18) Pipelined SRAM | |
CY7C1382DV33 | CYPRESS |
获取价格 |
18-Mbit (512 K Ã 36/1 M Ã 18) Pipelined SRA | |
CY7C1382DV33-200BZI | CYPRESS |
获取价格 |
18-Mbit (512 K Ã 36/1 M Ã 18) Pipelined SRA | |
CY7C1382F | CYPRESS |
获取价格 |
18-Mbit (512K x 36/1M x 18) Pipelined SRAM | |
CY7C1382F-167AXI | CYPRESS |
获取价格 |
Cache SRAM, 1MX18, 3.4ns, CMOS, PQFP100, 20 X 14 MM, 1.4 MM HEIGHT, LEAD FREE, PLASTIC, MS | |
CY7C1382F-167BGC | CYPRESS |
获取价格 |
18-Mbit (512K x 36/1M x 18) Pipelined SRAM | |
CY7C1382F-167BGI | CYPRESS |
获取价格 |
18-Mbit (512K x 36/1M x 18) Pipelined SRAM | |
CY7C1382F-167BGXC | CYPRESS |
获取价格 |
18-Mbit (512K x 36/1M x 18) Pipelined SRAM |