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CY7C1372B-200BZC PDF预览

CY7C1372B-200BZC

更新时间: 2024-09-19 05:19:23
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
27页 759K
描述
512K 】 36/1M 】 18 Pipelined SRAM with NoBL Architecture

CY7C1372B-200BZC 数据手册

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CY7C1370B  
CY7C1372B  
512K × 36/1M × 18 Pipelined SRAM with NoBL Architecture  
inputs include all addresses, all data inputs, depth-expansion  
Chip Enables (CE1, CE2, and CE3), cycle start input (ADV/LD),  
Features  
Zero Bus Latency, no dead cycles between Write and  
Clock enable (CEN), byte Write Enables (BWSa, BWSb,  
BWSc, and BWSd), and Read-Write Control (WE). BWSc and  
BWSd apply to CY7C1370B only.  
Read cycles  
Fast clock speed: 200, 167, 150, and 133 MHz  
Fast access time: 3.0, 3.4, 3.8, and 4.2 ns  
Internally synchronized registered outputs eliminate  
the need to control OE  
Address and control signals are applied to the SRAM during  
one clock cycle, and two cycles later, its associated data  
occurs, either Read or Write.  
Single 3.3V 5% and +10% power supply VDD  
Separate VDDQ for 3.3V or 2.5V I/O  
Single WE (Read/Write) control pin  
Positive clock-edge triggered address, data, and  
control signal registers for fully pipelined applications  
A
Clock enable (CEN) pin allows operation of the  
CY7C1370B/CY7C1372B to be suspended as long as  
necessary. All synchronous inputs are ignored when CEN is  
HIGH and the internal device registers will hold their previous  
values.  
There are three chip enable pins (CE1, CE2, CE3) that allow  
the user to deselect the device when desired. If any one of  
these three are not active when ADV/LD is LOW, no new  
memory operation can be initiated and any burst cycle in  
progress is stopped. However, any pending data transfers  
(Read or Write) will be completed. The data bus will be in  
high-impedance state two cycles after the chip is deselected  
or a Write cycle is initiated.  
Interleaved or linear four-word burst capability  
Individual byte Write (BWSaBWSd) control (may be  
tied LOW)  
CEN pin to enable clock and suspend operations  
Three chip enables for simple depth expansion  
JTAG boundary scan (BGA package only)  
Available in 119-ball bump BGA and 100-pin TQFP  
packages  
The CY7C1370B and CY7C1372B have an on-chip two-bit  
burst counter. In the burst mode, the CY7C1370B and  
CY7C1372B provide four cycles of data for a single address  
presented to the SRAM. The order of the burst sequence is  
defined by the MODE input pin. The MODE pin selects  
between linear and interleaved burst sequence. The ADV/LD  
signal is used to load a new external address (ADV/LD = LOW)  
or increment the internal burst counter (ADV/LD = HIGH)  
Automatic power down available using ZZ mode or CE  
deselect  
Functional Description  
The CY7C1370B and CY7C1372B SRAMs are designed to  
eliminate dead cycles when transitions from Read to Write or  
vice versa. These SRAMs are optimized for 100 percent bus  
utilization and achieve Zero Bus Latency. They integrate  
524,288 × 36 and 1,048,576 × 18 SRAM cells, respectively,  
with advanced synchronous peripheral circuitry and a 2-bit  
counter for internal burst operation. The Synchronous Burst  
SRAM family employs high-speed, low-power CMOS designs  
using advanced single-layer polysilicon, three-layer metal  
technology. Each memory cell consists of six transistors.  
Output enable (OE) and burst sequence select (MODE) are  
the asynchronous signals. OE can be used to disable the  
outputs at any given time. ZZ may be tied to LOW if it is not  
used.  
Four pins are used to implement JTAG test capabilities. The  
JTAG circuitry is used to serially shift data to and from the  
device. JTAG inputs use LVTTL/LVCMOS levels to shift data  
during this testing mode of operation.  
All synchronous inputs are gated by registers controlled by a  
positive-edge-triggered Clock input (CLK). The synchronous  
Logic Block Diagram  
D
CLK  
Data-In REG.  
CE  
Q
ADV/LD  
Ax  
CEN  
CE  
2
CE  
3
CONTROL  
and Write  
LOGIC  
256K × 36/  
512K × 18  
MEMORY  
1
CE  
DQ  
X
ARRAY  
DP  
WE  
BWS  
X
CY7C1370 CY7C1372  
X = 18:0 X = 19:0  
X
A
X
Mode  
X = a, b, c, d X = a, b  
DQ  
X
X = a, b, c, d X = a, b  
X = a, b, c, d X = a, b  
DP  
X
BWS  
X
OE  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose  
CA 95134  
408-943-2600  
Document #: 38-05197 Rev. **  
Revised December 3, 2001  

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