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CY7C1352B-150AC PDF预览

CY7C1352B-150AC

更新时间: 2024-11-25 22:45:27
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
12页 190K
描述
256K x 18 Pipilined SRAm with NoBL Architecture

CY7C1352B-150AC 数据手册

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PRELIMINARY  
CY7C1352B  
256K x18 Pipelined SRAM with NoBL™ Architecture  
• Low standby power  
Features  
Functional Description  
• Pin compatible and functionally equivalent to ZBT™  
devices MCM63Z818 and MT55L256L18P  
The CY7C1352B is a 3.3V 256K by 18 synchronous-pipelined  
Burst SRAM designed specifically to support unlimited true  
back-to-back Read/Write operations without the insertion of  
wait states. The CY7C1352B is equipped with the advanced  
No Bus Latency™ (NoBL™) logic required to enable consec-  
utive Read/Write operations with data being transferred on ev-  
ery clock cycle. This feature dramatically improves the  
throughput of the SRAM, especially in systems that require  
frequent Read/Write transitions. The CY7C1352B is pin/func-  
tionally compatible to ZBT SRAMs MCM63Z819 and  
MT55L256L18P.  
• Supports 166-MHz bus operations with zero wait states  
— Data is transferred on every clock  
• Internally self-timed output buffer control to eliminate  
the need to use OE  
• Fully registered (inputs and outputs) for pipelined  
operation  
• Byte Write Capability  
• 256K x 18 common I/O architecture  
• Single 3.3V power supply  
All synchronous inputs pass through input registers controlled  
by the rising edge of the clock. All data outputs pass through  
output registers controlled by the rising edge of the clock. The  
clock input is qualified by the Clock Enable (CEN) signal, which  
when deasserted suspends operation and extends the previ-  
ous clock cycle. Maximum access delay from the clock rise is  
3.5 ns (166-MHz device).  
• Fast clock-to-output times  
— 3.5 ns (for 166-MHz device)  
— 3.8 ns (for 150-MHz device)  
— 4.0 ns (for 143-MHz device)  
— 4.2 ns (for 133-MHz device)  
— 5.0 ns (for 100-MHz device)  
Write operations are controlled by the four Byte Write Select  
— 7.0 ns (for 80-MHz device)  
(BWS  
) and a Write Enable (WE) input. All writes are con-  
[1:0]  
• Clock Enable (CEN) pin to suspend operation  
• Synchronous self-timed writes  
• Asynchronous output enable  
• JEDEC-standard 100-pin TQFP package  
• Burst Capability—linear or interleaved burst order  
ducted with on-chip synchronous self-timed write circuitry.  
Three synchronous Chip Enables (CE , CE , CE ) and an  
1
2
3
asynchronous Output Enable (OE) provide for easy bank se-  
lection and output three-state control. In order to avoid bus  
contention, the output drivers are synchronously three-stated  
during the data portion of a write sequence.  
Logic Block Diagram  
18  
D
CLK  
Data-In REG.  
CE  
Q
18  
ADV/LD  
18  
A[17:0]  
CEN  
CE  
CONTROL  
and WRITE  
LOGIC  
18  
256Kx18  
1
CE  
MEMORY  
2
DQ[15:0]  
DP[1:0]  
CE  
ARRAY  
18  
18  
3
WE  
BWS  
[1:0]  
Mode  
OE  
.
Selection Guide  
-166  
3.5  
400  
5
-150  
3.8  
375  
5
-143  
4.0  
350  
5
-133  
4.2  
300  
5
-100  
5.0  
250  
5
-80  
7.0  
200  
5
Maximum Access Time (ns)  
Maximum Operating Current (mA)  
Commercial  
Maximum CMOS Standby Current (mA) Commercial  
Shaded areas contain advance information.  
NoBL and No Bus Latency are trademarks of Cypress Semiconductor Corporation.  
ZBT is a trademark of Integrated Device Technology.  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose  
CA 95134  
408-943-2600  
May 26, 2000  

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