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CY7C1319CV18 PDF预览

CY7C1319CV18

更新时间: 2024-11-20 03:14:19
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器双倍数据速率
页数 文件大小 规格书
31页 700K
描述
18-Mbit DDR-II SRAM 4-Word Burst Architecture

CY7C1319CV18 数据手册

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CY7C1317CV18, CY7C1917CV18  
CY7C1319CV18, CY7C1321CV18  
18-Mbit DDR-II SRAM 4-Word  
Burst Architecture  
Features  
Functional Description  
18-Mbit density (2M x 8, 2M x 9, 1M x 18, 512K x 36)  
300 MHz clock for high bandwidth  
The CY7C1317CV18, CY7C1917CV18, CY7C1319CV18, and  
CY7C1321CV18 are 1.8V Synchronous Pipelined SRAMs  
equipped with DDR-II architecture. The DDR-II consists of an  
SRAM core with advanced synchronous peripheral circuitry and  
a two-bit burst counter. Addresses for read and write are latched  
on alternate rising edges of the input (K) clock. Write data is  
registered on the rising edges of both K and K. Read data is  
driven on the rising edges of C and C if provided, or on the rising  
edge of K and K if C/C are not provided. Each address location  
is associated with four 8-bit words in the case of CY7C1317CV18  
and four 9-bit words in the case of CY7C1917CV18 that burst  
sequentially into or out of the device. The burst counter always  
starts with a ‘00’ internally in the case of CY7C1317CV18 and  
CY7C1917CV18. For CY7C1319CV18 and CY7C1321CV18,  
the burst counter takes in the least two significant bits of the  
external address and bursts four 18-bit words in the case of  
CY7C1319CV18, and four 36-bit words in the case of  
CY7C1321CV18, sequentially into or out of the device.  
4-word burst for reducing address bus frequency  
Double Data Rate (DDR) interfaces  
(data transferred at 600 MHz) at 300 MHz  
Two input clocks (K and K) for precise DDR timing  
SRAM uses rising edges only  
Two input clocks for output data (C and C) to minimize clock  
skew and flight time mismatches  
Echo clocks (CQ and CQ) simplify data capture in high-speed  
systems  
Synchronous internally self-timed writes  
DDR-II operates with 1.5 cycle read latency when the DLL is  
enabled  
Asynchronous inputs include an output impedance matching  
input (ZQ). Synchronous data outputs (Q, sharing the same  
physical pins as the data inputs, D) are tightly matched to the two  
output echo clocks CQ/CQ, eliminating the need to capture data  
separately from each individual DDR SRAM in the system  
design. Output data clocks (C/C) enable maximum system  
clocking and data synchronization flexibility.  
Operates similar to a DDR-I device with 1 cycle read latency in  
DLL off mode  
1.8V core power supply with HSTL inputs and outputs  
Variable drive HSTL output buffers  
Expanded HSTL output voltage (1.4V–VDD  
)
All synchronous inputs pass through input registers controlled by  
the K or K input clocks. All data outputs pass through output  
registers controlled by the C or C (or K or K in a single clock  
domain) input clocks. Writes are conducted with on-chip  
synchronous self-timed write circuitry.  
Available in 165-Ball FBGA package (13 x 15 x 1.4 mm)  
Offered in both Pb-free and non Pb-free packages  
JTAG 1149.1 compatible test access port  
Delay Lock Loop (DLL) for accurate data placement  
Configurations  
CY7C1317CV18 – 2M x 8  
CY7C1917CV18 – 2M x 9  
CY7C1319CV18 – 1M x 18  
CY7C1321CV18 – 512K x 36  
Selection Guide  
Description  
300 MHz  
300  
278 MHz  
278  
250 MHz  
250  
200 MHz  
200  
167 MHz  
167  
Unit  
MHz  
mA  
Maximum Operating Frequency  
Maximum Operating Current  
x8  
x9  
770  
720  
670  
580  
515  
770  
720  
670  
580  
515  
x18  
x36  
810  
760  
700  
600  
540  
890  
830  
765  
655  
600  
Cypress Semiconductor Corporation  
Document Number: 001-07161 Rev. *B  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised September 26, 2007  
[+] Feedback  

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