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CY7C1071AV33-10BBC PDF预览

CY7C1071AV33-10BBC

更新时间: 2024-12-01 05:09:31
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 存储内存集成电路静态存储器
页数 文件大小 规格书
10页 148K
描述
32-Mbit (2M x 16) Static RAM

CY7C1071AV33-10BBC 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:BGA,
针数:119Reach Compliance Code:unknown
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.91最长访问时间:10 ns
JESD-30 代码:R-PBGA-B119JESD-609代码:e0
长度:22 mm内存密度:33554432 bit
内存集成电路类型:STANDARD SRAM内存宽度:16
功能数量:1端子数量:119
字数:2097152 words字数代码:2000000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:2MX16
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装形状:RECTANGULAR封装形式:GRID ARRAY
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
认证状态:Not Qualified座面最大高度:2.02 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:TIN LEAD端子形式:BALL
端子节距:1.27 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:14 mm
Base Number Matches:1

CY7C1071AV33-10BBC 数据手册

 浏览型号CY7C1071AV33-10BBC的Datasheet PDF文件第2页浏览型号CY7C1071AV33-10BBC的Datasheet PDF文件第3页浏览型号CY7C1071AV33-10BBC的Datasheet PDF文件第4页浏览型号CY7C1071AV33-10BBC的Datasheet PDF文件第5页浏览型号CY7C1071AV33-10BBC的Datasheet PDF文件第6页浏览型号CY7C1071AV33-10BBC的Datasheet PDF文件第7页 
PRELIMINARY  
CY7C1071AV33  
32-Mbit (2M x 16) Static RAM  
Low Enable (BLE) is LOW, then data from the I/O pins (I/O0  
through I/O7), is written into the location specified on the ad-  
dress pins (A0 through A20). If Byte High Enable (BHE) is  
LOW, then data from I/O pins (I/O8 through I/O15) is written into  
the location specified on the address pins (A0 through A20).  
Features  
• High density 32-Mbit SRAM  
• High speed  
— tAA = 10 ns  
Reading from the device is accomplished by enabling the chip  
by taking CE HIGH while forcing the Output Enable (OE) LOW  
and the Write Enable (WE) HIGH. If Byte Low Enable (BLE) is  
LOW, then data from the memory location specified by the  
address pins will appear on I/O0 to I/O7. If Byte High Enable  
(BHE) is LOW, then data from memory will appear on I/O8 to  
I/O15. See the truth table at the back of this data sheet for a  
complete description of Read and Write modes.  
• Low active power  
— ICC = 450 mA  
• Operating voltages of 3.3 ± 0.3V  
• 2.0V data retention  
• Automatic power-down when deselected  
• TTL-compatible inputs and outputs  
• Available in standard 119-ball FBGA  
The input/output pins (I/O0 through I/O15) are placed in a  
high-impedance state when the device is deselected (CE  
LOW), the outputs are disabled (OE HIGH), the BHE and BLE  
are disabled (BHE, BLE HIGH), or during a Write operation  
(CE HIGH, and WE LOW).  
Functional Description  
The CY7C1071AV33 is a 3.3V high-performance 32-Megabit  
static RAM organized as a 2,097,152 words by 16 bits.  
The CY7C1071AV33 is available in a 119-ball grid array  
(FBGA) package.  
Writing to the device is accomplished by enabling the chip (CE  
HIGH) while forcing the Write Enable (WE) input LOW. If Byte  
Logic Block Diagram  
DATA-IN DRIVERS  
A10  
A 9  
A 8  
A 7  
A 6  
A 5  
A 4  
A 3  
2048K × 16  
RAM Array  
I/O0–I/O7  
I/O8–I/O15  
A 2  
A 1  
A 0  
COLUMN DECODER  
BHE  
WE  
CE  
OE  
BLE  
Power-down  
Circuit  
CE  
Cypress Semiconductor Corporation  
Document #: 38-05634 Rev. *A  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised September 1, 2005  

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