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CY7C1072AV33-12BBC PDF预览

CY7C1072AV33-12BBC

更新时间: 2024-12-01 05:09:31
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 存储内存集成电路静态存储器
页数 文件大小 规格书
9页 147K
描述
32-Mbit (1M x 32) Static RAM

CY7C1072AV33-12BBC 技术参数

是否Rohs认证:不符合生命周期:Obsolete
零件包装代码:BGA包装说明:BGA,
针数:119Reach Compliance Code:unknown
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.92Is Samacsys:N
最长访问时间:12 nsJESD-30 代码:R-PBGA-B119
JESD-609代码:e0长度:22 mm
内存密度:33554432 bit内存集成电路类型:STANDARD SRAM
内存宽度:32功能数量:1
端子数量:119字数:1048576 words
字数代码:1000000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:1MX32封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装形状:RECTANGULAR
封装形式:GRID ARRAY并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
座面最大高度:2.02 mm最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:TIN LEAD
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:14 mmBase Number Matches:1

CY7C1072AV33-12BBC 数据手册

 浏览型号CY7C1072AV33-12BBC的Datasheet PDF文件第2页浏览型号CY7C1072AV33-12BBC的Datasheet PDF文件第3页浏览型号CY7C1072AV33-12BBC的Datasheet PDF文件第4页浏览型号CY7C1072AV33-12BBC的Datasheet PDF文件第5页浏览型号CY7C1072AV33-12BBC的Datasheet PDF文件第6页浏览型号CY7C1072AV33-12BBC的Datasheet PDF文件第7页 
PRELIMINARY  
CY7C1072AV33  
32-Mbit (1M x 32) Static RAM  
specified on the address pins (A0 through A19). If Byte Enable  
B (BB) is LOW, then data from I/O pins (I/O8 through I/O15) is  
written into the location specified on the address pins (A0  
through A19). Likewise, BC and BD correspond with the I/O  
pins I/O16 to I/O23 and I/O24 to I/O31, respectively.  
Features  
• High density 32-Mbit SRAM  
• High speed  
— tAA = 10 ns  
Reading from the device is accomplished by enabling the chip  
by taking CE1 LOW and CE2 HIGH while forcing the Output  
Enable (OE) LOW and the Write Enable (WE) HIGH. If the first  
Byte Enable (BA) is LOW, then data from the memory location  
specified by the address pins will appear on I/O0 to I/O7. If Byte  
Enable B (BB) is LOW, then data from memory will appear on  
I/O8 to I/O15. Similarly, Bc and BD correspond to the third and  
fourth bytes. See the truth table at the back of this data sheet  
for a complete description of read and write modes.  
• Low active power  
— ICC = 450 mA  
• Operating voltages of 3.3 ± 0.3V  
• 2.0V data retention  
• Automatic power-down when deselected  
• TTL compatible inputs and outputs  
• Available in standard 119-ball FBGA  
The input/output pins (I/O0 through I/O31) are placed in a  
high-impedance state when the device is deselected (CE1  
HIGH/CE2 LOW), the outputs are disabled (OE HIGH), the  
byte selects are disabled (BA-D HIGH), or during a Write  
operation (CE1 LOW, CE2 HIGH, and WE LOW).  
Functional Description  
The CYM1072AV33 is a 3.3V high-performance 32-Megabit  
static RAM organized as 1M words by 32 bits.  
The CY7C1072AV33 is available in a 119-ball grid array  
(FBGA) package.  
Writing to the device is accomplished by enabling the chip  
(CE1 LOW and CE2 HIGH) while forcing the Write Enable  
(WE) input LOW. If Byte Enable A (BA) is LOW, then data from  
the I/O pins (I/O0 through I/O7), is written into the location  
WE  
CE1  
CE2  
Logic Block Diagram  
INPUT BUFFERS  
OE  
BA  
BB  
A0  
A1  
A2  
A3  
A4  
BC  
BD  
1024K x 32  
ARRAY  
I/O0–I/O31  
A5  
A6  
A7  
A8  
A9  
COLUMN  
DECODER  
Selection Guide  
CY7C1072AV33-10  
CY7C1072AV33-12  
Unit  
ns  
Maximum Access Time  
10  
12  
Maximum Operating Current  
Maximum Standby Current  
450  
100  
400  
100  
mA  
mA  
Cypress Semiconductor Corporation  
Document #: 38-05635 Rev. *A  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised September 1, 2005  

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