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CY7C1021CV33-10BAXIT PDF预览

CY7C1021CV33-10BAXIT

更新时间: 2024-11-11 20:04:43
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器内存集成电路
页数 文件大小 规格书
14页 301K
描述
Standard SRAM, 64KX16, 10ns, CMOS, PBGA48, 7 X 7 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-48

CY7C1021CV33-10BAXIT 技术参数

生命周期:Obsolete零件包装代码:BGA
包装说明:TFBGA,针数:48
Reach Compliance Code:unknownECCN代码:3A991.B.2.B
HTS代码:8542.32.00.41风险等级:5.2
最长访问时间:10 nsJESD-30 代码:S-PBGA-B48
JESD-609代码:e1长度:7 mm
内存密度:1048576 bit内存集成电路类型:STANDARD SRAM
内存宽度:16功能数量:1
端子数量:48字数:65536 words
字数代码:64000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:64KX16封装主体材料:PLASTIC/EPOXY
封装代码:TFBGA封装形状:SQUARE
封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH并行/串行:PARALLEL
认证状态:Not Qualified座面最大高度:1.2 mm
最大供电电压 (Vsup):3.63 V最小供电电压 (Vsup):2.97 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:TIN SILVER COPPER端子形式:BALL
端子节距:0.75 mm端子位置:BOTTOM
宽度:7 mmBase Number Matches:1

CY7C1021CV33-10BAXIT 数据手册

 浏览型号CY7C1021CV33-10BAXIT的Datasheet PDF文件第2页浏览型号CY7C1021CV33-10BAXIT的Datasheet PDF文件第3页浏览型号CY7C1021CV33-10BAXIT的Datasheet PDF文件第4页浏览型号CY7C1021CV33-10BAXIT的Datasheet PDF文件第5页浏览型号CY7C1021CV33-10BAXIT的Datasheet PDF文件第6页浏览型号CY7C1021CV33-10BAXIT的Datasheet PDF文件第7页 
CY7C1021CV33  
1-Mbit (64K x 16) Static RAM  
Features  
Functional Description  
Temperature ranges  
The CY7C1021CV33 is a high performance CMOS static RAM  
organized as 65,536 words by 16 bits. This device has an  
automatic power down feature that significantly reduces power  
consumption when deselected.  
Commercial: 0°C to 70°C  
Industrial: –40°C to 85°C  
Automotive-A: –40°C to 85°C  
Automotive-E: –40°C to 125°C  
Writing to the device is accomplished by taking Chip Enable (CE)  
and Write Enable (WE) inputs LOW. If Byte Low Enable (BLE) is  
LOW, then data from IO pins (IO1 through IO8), is written into the  
location specified on the address pins (A0 through A15). If Byte  
High Enable (BHE) is LOW, then data from IO pins (IO9 through  
IO16) is written into the location specified on the address pins (A0  
through A15).  
Pin and function compatible with CY7C1021BV33  
High speed  
tAA = 8 ns (Commercial)  
tAA = 10 ns (Industrial and Automotive-A)  
tAA = 12 ns (Automotive-E)  
Reading from the device is accomplished by taking Chip Enable  
(CE) and Output Enable (OE) LOW while forcing the Write  
Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data  
from the memory location specified by the address pins appear  
on IO1 to IO8. If Byte High Enable (BHE) is LOW, then data from  
memory appears on IO9 to IO16. For more information, see the  
“Truth Table” on page 9 for a complete description of Read and  
Write modes.  
CMOS for optimum speed and power  
Low active power: 325 mW (max)  
Automatic power down when deselected  
Independent control of upper and lower bits  
AvailableinPb-freeandnonPb-free44-pin400MilSOJ, 44-pin  
TSOP II and 48-Ball FBGA packages  
The input and output pins (IO1 through IO16) are placed in a high  
impedance state when the device is deselected (CE HIGH), the  
outputs are disabled (OE HIGH), the BHE and BLE are disabled  
(BHE, BLE HIGH), or during a write operation (CE LOW and WE  
LOW).  
For best practice recommendations, refer to the Cypress  
application note AN1064, SRAM System Guidelines.  
Logic Block Diagram  
DATA IN DRIVERS  
A7  
A6  
A5  
64K x 16  
A4  
IO0–IO7  
RAM Array  
A3  
A2  
A1  
A0  
IO8–IO15  
COLUMN DECODER  
BHE  
WE  
CE  
OE  
BLE  
Cypress Semiconductor Corporation  
Document Number: 38-05132 Rev. *I  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised January 04, 2008  
[+] Feedback  

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