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CY62147DV30_06 PDF预览

CY62147DV30_06

更新时间: 2024-11-19 04:53:27
品牌 Logo 应用领域
赛普拉斯 - CYPRESS /
页数 文件大小 规格书
12页 367K
描述
4-Mbit (256K x 16) Static RAM

CY62147DV30_06 数据手册

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CY62147DV30  
4-Mbit (256K x 16) Static RAM  
vanced circuit design to provide ultra-low active current. This  
is ideal for providing More Battery Life™ (MoBL®) in portable  
applications such as cellular telephones. The device also has  
an automatic power-down feature that significantly reduces  
power consumption. The device can also be put into standby  
mode reducing power consumption by more than 99% when  
deselected (CE HIGH or both BLE and BHE are HIGH). The  
input/output pins (I/O0 through I/O15) are placed in a high-im-  
pedance state when: deselected (CE HIGH), outputs are dis-  
abled (OE HIGH), both Byte High Enable and Byte Low Enable  
are disabled (BHE, BLE HIGH), or during a write operation (CE  
LOW and WE LOW).  
Features  
• Temperature Ranges  
Industrial: –40°C to +85°C  
— Automotive-A: –40°C to +85°C  
— Automotive-E: –40°C to +125°C  
• Very high speed: 45 ns  
• Wide voltage range: 2.20V–3.60V  
• Pin-compatible with CY62147CV25, CY62147CV30, and  
CY62147CV33  
Writing to the device is accomplished by taking Chip Enable  
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable  
(BLE) is LOW, then data from I/O pins (I/O0 through I/O7), is  
written into the location specified on the address pins (A0  
through A17). If Byte High Enable (BHE) is LOW, then data  
from I/O pins (I/O8 through I/O15) is written into the location  
specified on the address pins (A0 through A17).  
• Ultra-low active power  
— Typical active current: 1.5 mA @ f = 1 MHz  
— Typical active current: 8 mA @ f = fmax  
• Ultra low standby power  
• Easy memory expansion with CE, and OE features  
• Automatic power-down when deselected  
• CMOS for optimum speed/power  
Reading from the device is accomplished by taking Chip  
Enable (CE) and Output Enable (OE) LOW while forcing the  
Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW,  
then data from the memory location specified by the address  
pins will appear on I/O0 to I/O7. If Byte High Enable (BHE) is  
LOW, then data from memory will appear on I/O8 to I/O15. See  
the truth table at the back of this data sheet for a complete  
description of read and write modes.  
• Available in Pb-free and non Pb-free 48-ball VFBGA and  
non Pb-free 44-pin TSOPII  
• Byte power-down feature  
Functional Description[1]  
The CY62147DV30 is available in a 48-ball VFBGA, 44 Pin  
TSOPII packages.  
The CY62147DV30 is a high-performance CMOS static RAM  
organized as 256K words by 16 bits. This device features ad-  
Logic Block Diagram  
DATA IN DRIVERS  
A
10  
9
A
A
8
7
6
A
A
A
A
256K x 16  
RAM Array  
5
4
3
2
I/O –I/O  
0
7
A
I/O –I/O  
A
8
15  
A
A
1
0
COLUMN DECODER  
BHE  
WE  
CE  
OE  
BLE  
CE  
Power -Down  
Circuit  
BHE  
BLE  
Note:  
1. For best practice recommendations, please refer to the Cypress application note “System Design Guidelines” on http://www.cypress.com.  
Cypress Semiconductor Corporation  
Document #: 38-05340 Rev. *F  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised August 31, 2006  
[+] Feedback  

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