®
®
CY62138CV25/30/33 MoBL
CY62138CV MoBL
2M (256K x 8) Static RAM
bits. This device features advanced circuit design to provide
ultra-low active current. This is ideal for providing More Battery
Life™ (MoBL®) in portable applications. The device also has
an automatic power-down feature that significantly reduces
power consumption by 80% when addresses are not toggling.
The device can be put into standby mode reducing power
consumption by more than 99% when deselected (CE1 HIGH
or CE2 LOW).
Features
• Very high speed: 55 ns and 70 ns
• Voltage range:
— CY62138CV25: 2.2V–2.7V
— CY62138CV30: 2.7V–3.3V
— CY62138CV33: 3.0V–3.6V
Writing to the device is accomplished by taking Chip Enable 1
(CE1) and Write Enable (WE) inputs LOW and Chip Enable 2
(CE2) HIGH. Data on the eight I/O pins (I/O0 through I/O7) is
then written into the location specified on the address pins (A0
through A17).
— CY62138CV: 2.7V–3.6V
• Pin-compatible with CY62138V
• Ultra low active power
— Typical active current: 1.5 mA @ f = 1 MHz
Reading from the device is accomplished by taking Chip
Enable 1 (CE1) and Output Enable (OE) LOW while forcing
Write Enable (WE) and Chip Enable 2 (CE2) HIGH. Under
these conditions, the contents of the memory location
specified by the address pins will appear on the I/O pins.
— Typical active current: 5.5 mA @ f = fmax (70-ns
speed)
• Low standby power
• Easy memory expansion with CE1, CE2, and OE
features
The eight input/output pins (I/O0 through I/O7) are placed in a
high-impedance state when the device is deselected (CE1
HIGH or CE2 LOW), the outputs are disabled (OE HIGH), or
during a write operation (CE1 LOW, CE2 HIGH and WE LOW).
See the truth table at the back of this data sheet for a complete
description of read and write modes.
• Automatic power-down when deselected
• CMOS for optimum speed/power
• Packages offered in a 36-ball FBGA
Functional Description[1]
The CY62138CV25/30/33 and CY62138CV are high-perfor-
mance CMOS static RAMs organized as 256K words by eight
Logic Block Diagram
I/O
I/O
I/O
I/O
I/O
I/O
I/O
0
1
2
3
4
5
Data in Drivers
A
0
A
1
A
2
3
4
A
A
A
5
A
256K x 8
ARRAY
6
A
7
A
8
A
9
A
10
A
11
6
7
POWER
DOWN
CE
CE
COLUMN
DECODER
1
2
I/O
WE
OE
Note:
1. For best practice recommendations, please refer to the Cypress application note “System Design Guidelines” on http://www.cypress.com.
Cypress Semiconductor Corporation
Document #: 38-05200 Rev. *D
•
3901 North First Street
•
San Jose
•
CA 95134
•
408-943-2600
Revised September 20, 2002