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CY62136V18LL-70BAI PDF预览

CY62136V18LL-70BAI

更新时间: 2024-11-04 23:45:07
品牌 Logo 应用领域
其他 - ETC 内存集成电路静态存储器
页数 文件大小 规格书
10页 253K
描述
x16 SRAM

CY62136V18LL-70BAI 数据手册

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CY62136V MoBL™  
CY62136V18 MoBL2™  
128K x 16 Static RAM  
put/output pins (I/O through I/O ) are placed in a high-im-  
Features  
0
15  
pedance state when: deselected (CE HIGH), outputs are dis-  
abled (OE HIGH), BHE and BLE are disabled (BHE, BLE  
HIGH), or during a write operation (CE LOW, and WE LOW).  
• Low voltage range:  
CY62136V18: 1.65V 1.95V  
Writing to the device is accomplished by taking Chip Enable  
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable  
— CY62136V: 2.7V 3.6V  
• Ultra-low active, standby power  
(BLE) is LOW, then data from I/O pins (I/O through I/O ), is  
0
7
• Easy memory expansion with CE and OE features  
• TTL-compatible inputs and outputs  
• Automatic power-down when deselected  
• CMOS for optimum speed/power  
written into the location specified on the address pins (A  
0
through A ). If Byte High Enable (BHE) is LOW, then data  
16  
from I/O pins (I/O through I/O ) is written into the location  
8
15  
specified on the address pins (A through A ).  
0
16  
Reading from the device is accomplished by taking Chip En-  
able (CE) and Output Enable (OE) LOW while forcing the Write  
Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then  
data from the memory location specified by the address pins  
Functional Description  
The CY62136V and CY62136V18 are high-performance  
CMOS static RAMs organized as 131,072 words by 16 bits.  
This device features advanced circuit design to provide ul-  
tra-low active current. This is ideal for providing More Battery  
Life™ (MoBL™) in portable applications such as cellular tele-  
phones. The device also has an automatic power-down fea-  
ture that significantly reduces power consumption by 99%  
when addresses are not toggling. The device can also be put  
into standby mode when deselected (CE HIGH). The in-  
will appear on I/O to I/O . If Byte High Enable (BHE) is LOW,  
0
7
then data from memory will appear on I/O to I/O . See the  
8
15  
Truth Table at the back of this data sheet for a complete de-  
scription of read and write modes.  
The CY62136V and CY62136V18 are available in 48-ball  
FBGA and standard 44-pin TSOP Type II (forward pinout)  
packaging.  
Logic Block Diagram  
Pin Configurations  
TSOP II (Forward)  
Top View  
44  
1
A
4
A
5
43  
42  
41  
40  
39  
38  
A
A
2
3
4
5
6
3
6
DATA IN DRIVERS  
A
A
2
7
OE  
A
1
BHE  
BLE  
I/O  
I/O  
I/O  
A
0
CE  
A9  
A7  
I/O  
7
0
15  
37  
36  
35  
34  
33  
I/O  
I/O  
8
1
2
14  
13  
12  
A6  
A3  
A2  
A1  
A0  
128K x 16  
9
10  
11  
12  
13  
I/O  
V
SS  
RAM Array  
1024 X 2048  
I/O  
I/O0–I/O7  
3
CC  
V
SS  
V
V
I/O8–I/O15  
CC  
I/O  
32  
I/O  
I/O  
4
5
6
7
11  
10  
I/O  
I/O  
I/O  
31  
30  
29  
28  
14  
15  
16  
I/O  
I/O  
9
8
WE 17  
NC  
18  
27  
26  
25  
A
A
8
16  
19  
A
A
9
COLUMN DECODER  
15  
A
20  
21  
22  
A
11  
14  
10  
A
A
12  
24  
23  
13  
A
NC  
BHE  
WE  
CE  
OE  
62136V–2  
BLE  
62136V–1  
More Battery Life and MoBL are trademarks of Cypress Semiconductor Corporation.  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose  
CA 95134  
408-943-2600  
January 20, 2000  

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