Datasheet > CRG03(T5L,MAT-PA,Q

CRG03(T5L,MAT-PA,Q

更新时间： 2024-09-18 06:09:11

品牌	Logo	应用领域
东芝 - TOSHIBA		二极管
页数	文件大小	规格书
4页	171K
描述
Rectifier Diode

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技术参数
数据手册

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CRG03(T5L,MAT-PA,Q 技术参数

生命周期：	Active	Reach Compliance Code：	unknown
风险等级：	5.72	二极管类型：	RECTIFIER DIODE
Base Number Matches：	1

CRG03(T5L,MAT-PA,Q 数据手册

浏览型号CRG03(T5L,MAT-PA,Q的Datasheet PDF文件第2页

CRG03

TOSHIBA Rectifier Silicon Diffused Type

CRG03

Unit: mm

General Purpose Rectifier Applications

•

Average forward current: I

= 1.0 A

F (AV)

Repetitive peak reverse voltage: V

= 400 V

RRM

Suitable for compact assembly due to small surface-mount package

“S−FLAT^TM” (Toshiba package name)

Absolute Maximum Ratings (Ta = 25°C)

Characteristics

Symbol

Rating

Unit

Repetitive Peak Reverse Voltage

Average Forward Current

400

RRM

1.0（Note）

15.0 (50Hz)

F (AV)

Peak One Cycle Surge Forward

Current (Non−Repetitive)

FSM

16.5 (60Hz)

−40~150

Junction Temperature

°C

Storage Temperature Range

−40~150

stg

JEDEC

JEITA

―

Note: 1 Ta = 56°C

Device mounted on a ceramic board

board size: 50 mm × 50 mm

soldering land: 2 mm × 2 mm

board thickness 0.64t

TOSHIBA

3-2A1A

Weight: 0.013 g (typ.)

Note 2: Using continuously under heavy loads (e.g. the application of

high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to

decrease in the reliability significantly even if the operating conditions (i.e. operating

temperature/current/voltage, etc.) are within the absolute maximum ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Electrical Characteristics (Ta = 25°C)

Characteristics

Symbol

Test Condition

= 0.1 A (Pulse test)

Min

Typ.

Max

Unit

FM(1)

FM(2)

FM(3)

RRM

⎯

0.86

0.97

1.0

⎯

1.1

⎯

Peak forward voltage

= 0.7 A (Pulse test)

= 1.0 A (Pulse test)

Repetitive peak reverse current

= 400 V (Pulse test)

⎯

μA

RRM

Device mounted on a ceramic board

Board size: 50 mm × 50 mm

Soldering land: 2 mm × 2 mm

Board thickness: 0.64t

⎯

th (j-a)

°C/W

Device mounted on a glass-epoxy

board

Thermal resistance

Board size: 50 mm × 50 mm

Soldering land: 6 mm × 6 mm

Board thickness: 1.6t

⎯

130

th (j-ℓ)

―

°C/W

Start of commercial production

2003-07

2013-11-01

12 3 4

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