CRG03
TOSHIBA Rectifier Silicon Diffused Type
CRG03
General Purpose Rectifier Applications
Unit: mm
•
•
•
Average forward current: I
= 1.0 A
F (AV)
Repetitive peak reverse voltage: V
= 400 V
RRM
Suitable for compact assembly due to small surface-mount package
“S−FLATTM” (Toshiba package name)
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Repetitive Peak Reverse Voltage
Average Forward Current
V
400
V
A
RRM
I
1.0(Note)
15.0 (50Hz)
F (AV)
Peak One Cycle Surge Forward
Current (Non−Repetitive)
I
A
FSM
16.5 (60Hz)
−40~150
Junction Temperature
T
°C
°C
j
Storage Temperature Range
T
−40~150
stg
JEDEC
JEITA
―
―
Note: 1 Ta = 56°C
Device mounted on a ceramic board
board size: 50 mm × 50 mm
soldering land: 2 mm × 2 mm
board thickness 0.64t
TOSHIBA
3-2A1A
Weight: 0.013 g (typ.)
Note 2: Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to
decrease in the reliability significantly even if the operating conditions (i.e. operating
temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
= 0.1 A (Pulse test)
Min
Typ.
Max
Unit
V
FM(1)
V
FM(2)
V
FM(3)
I
RRM
I
I
I
⎯
⎯
⎯
⎯
0.86
0.97
1.0
⎯
1.1
⎯
V
V
FM
FM
FM
Peak forward voltage
= 0.7 A (Pulse test)
= 1.0 A (Pulse test)
V
Repetitive peak reverse current
V
= 400 V (Pulse test)
⎯
10
μA
RRM
Device mounted on a ceramic board
Board size: 50 mm × 50 mm
Soldering land: 2 mm × 2 mm
Board thickness: 0.64t
⎯
⎯
65
R
th (j-a)
°C/W
Device mounted on a glass-epoxy
board
Thermal resistance
Board size: 50 mm × 50 mm
Soldering land: 6 mm × 6 mm
Board thickness: 1.6t
⎯
⎯
⎯
⎯
130
20
R
th (j-ℓ)
―
°C/W
2006-11-06
1