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CRG05 PDF预览

CRG05

更新时间: 2024-11-07 12:54:27
品牌 Logo 应用领域
东芝 - TOSHIBA 整流二极管光电二极管
页数 文件大小 规格书
4页 176K
描述
General-Purpose Rectifier Applications

CRG05 技术参数

生命周期:Active包装说明:S-FLAT, 3-2A1A, 2 PIN
针数:2Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.10.00.80
风险等级:5.53Is Samacsys:N
配置:SINGLE二极管元件材料:SILICON
二极管类型:RECTIFIER DIODEJESD-30 代码:R-PDSO-F2
元件数量:1端子数量:2
最高工作温度:150 °C最低工作温度:-40 °C
最大输出电流:1 A封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
认证状态:Not Qualified最大重复峰值反向电压:800 V
表面贴装:YES端子形式:FLAT
端子位置:DUALBase Number Matches:1

CRG05 数据手册

 浏览型号CRG05的Datasheet PDF文件第2页浏览型号CRG05的Datasheet PDF文件第3页浏览型号CRG05的Datasheet PDF文件第4页 
CRG05  
TOSHIBA Rectifier Silicon Diffused Type  
CRG05  
General-Purpose Rectifier Applications  
Unit: mm  
Repetitive peak reverse voltage: V  
= 800 V  
RRM  
Average forward current: I  
= 1.0 A  
F (AV)  
Average forward voltage: V  
= 1.2V (Max.)  
FM  
Suitable for high-density board assembly due to the use of a small  
surface-mount package, SFLAT  
0.9 ± 0.1  
Absolute Maximum Ratings (Ta = 25°C)  
0.16  
+ 0.2  
1.6  
0.1  
Characteristics  
Symbol  
Rating  
Unit  
Repetitive Peak Reverse Voltage  
Average Forward Current  
V
800  
V
A
RRM  
ANODE  
CATHODE  
I
1.0(Note1)  
F (AV)  
Peak One Cycle Surge Forward  
Current (NonRepetitive)  
I
15.0 (50Hz)  
A
FSM  
Junction Temperature  
T
40 to 150  
40 to 150  
°C  
°C  
j
JEDEC  
JEITA  
Storage Temperature Range  
T
stg  
Note 1: Ta=54°C  
Device mounted on a ceramic board  
board size: 50 mm × 50 mm  
TOSHIBA  
3-2A1A  
Weight: 0.013 g (typ.)  
soldering land: 2 mm ×2 mm  
board thickness: 0.64 mm  
Half-sine waveform: α =180°  
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
2008-02-01  
1

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