CRG04
TOSHIBA Rectifier Silicon Diffused Type
CRG04
General-Purpose Rectifier Applications
Unit: mm
•
•
•
•
Repetitive peak reverse voltage: V
= 600 V
RRM
②
Average forward current: I
= 1.0 A
F (AV)
Average forward voltage: V
= 1.1V(Max)
FM
Suitable for high-density board assembly due to the use of a small
surface-mount package, S−FLATTM
Absolute Maximum Ratings (Ta = 25°C)
0.9 ± 0.1
0.16
+ 0.2
− 0.1
①
1.6
Characteristics
Symbol
Rating
Unit
Repetitive Peak Reverse Voltage
Average Forward Current
V
600
V
A
RRM
① ANODE
② CATHODE
I
1.0(Note1)
F (AV)
Peak One Cycle Surge Forward
Current (Non−Repetitive)
I
15.0 (50Hz)
A
FSM
Junction Temperature
T
−40 to 150
−40 to 150
°C
°C
j
Storage Temperature Range
T
stg
JEDEC
JEITA
―
―
Note 1: Ta=66°C
Device mounted on a ceramic board
board size: 50 mm × 50 mm
soldering land: 2 mm ×2 mm
board thickness: 0.64 mm
TOSHIBA
3-2A1A
Weight: 0.013 g (typ.)
Half-sine waveform: α =180°
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
= 0.1 A (Pulse test)
Min
Typ.
Max
Unit
V
FM(1)
V
FM(2)
V
FM(3)
I
RRM
I
I
I
⎯
⎯
⎯
⎯
0.84
0.95
0.98
⎯
⎯
⎯
V
V
FM
FM
FM
Peak forward voltage
= 0.7 A (Pulse test)
= 1.0 A (Pulse test)
1.1
10
V
Repetitive peak reverse current
Thermal resistance
V
= 600 V (Pulse test)
μA
RRM
Device mounted on a ceramic board
Board size: 50 mm × 50 mm
Soldering land: 2 mm × 2 mm
Board thickness: 0.64 mm
⎯
⎯
65
R
°C/W
th (j-a)
Device mounted on a glass-epoxy board
Board size: 50 mm × 50 mm
Soldering land: 6 mm × 6 mm
Board thickness: 1.6 mm
⎯
⎯
⎯
⎯
130
20
R
th (j-ℓ)
―
°C/W
2008-02-01
1