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CRG04

更新时间： 2024-11-07 12:54:31
品牌 Logo 应用领域
东芝 - TOSHIBA 整流二极管光电二极管
页数 文件大小 规格书
4页 177K
描述
General-Purpose Rectifier Applications

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中文翻译

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CRG04 技术参数

生命周期：Active包装说明：R-PDSO-F2
针数：2Reach Compliance Code：unknown
ECCN代码：EAR99HTS代码：8541.10.00.80
风险等级：5.51Is Samacsys：N
配置：SINGLE二极管元件材料：SILICON
二极管类型：RECTIFIER DIODEJESD-30 代码：R-PDSO-F2
元件数量：1端子数量：2
最大输出电流：1 A封装主体材料：PLASTIC/EPOXY
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
认证状态：Not Qualified最大重复峰值反向电压：600 V
表面贴装：YES端子形式：FLAT
端子位置：DUALBase Number Matches：1

CRG04 数据手册

 浏览型号CRG04的Datasheet PDF文件第2页浏览型号CRG04的Datasheet PDF文件第3页浏览型号CRG04的Datasheet PDF文件第4页 
CRG04  
TOSHIBA Rectifier Silicon Diffused Type  
CRG04  
General-Purpose Rectifier Applications  
Unit: mm  
•
•
•
•
Repetitive peak reverse voltage: V  
= 600 V  
RRM  
②
Average forward current: I  
= 1.0 A  
F (AV)  
Average forward voltage: V  
= 1.1V(Max)  
FM  
Suitable for high-density board assembly due to the use of a small  
surface-mount package, S−FLATTM  
Absolute Maximum Ratings (Ta = 25°C)  
0.9 ± 0.1  
0.16  
+ 0.2  
− 0.1  
①
1.6  
Characteristics  
Symbol  
Rating  
Unit  
Repetitive Peak Reverse Voltage  
Average Forward Current  
V
600  
V
A
RRM  
① ANODE  
② CATHODE  
I
1.0(Note1)  
F (AV)  
Peak One Cycle Surge Forward  
Current (Non−Repetitive)  
I
15.0 (50Hz)  
A
FSM  
Junction Temperature  
T
−40 to 150  
−40 to 150  
°C  
°C  
j
Storage Temperature Range  
T
stg  
JEDEC  
JEITA  
―
―
Note 1: Ta=66°C  
Device mounted on a ceramic board  
board size: 50 mm × 50 mm  
soldering land: 2 mm ×2 mm  
board thickness: 0.64 mm  
TOSHIBA  
3-2A1A  
Weight: 0.013 g (typ.)  
Half-sine waveform: α =180°  
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly  
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute  
maximum ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Electrical Characteristics (Ta = 25°C)  
Characteristics  
Symbol  
Test Condition  
= 0.1 A (Pulse test)  
Min  
Typ.  
Max  
Unit  
V
FM(1)  
V
FM(2)  
V
FM(3)  
I
RRM  
I
I
I
⎯
⎯
⎯
⎯
0.84  
0.95  
0.98  
⎯
⎯
⎯
V
V
FM  
FM  
FM  
Peak forward voltage  
= 0.7 A (Pulse test)  
= 1.0 A (Pulse test)  
1.1  
10  
V
Repetitive peak reverse current  
Thermal resistance  
V
= 600 V (Pulse test)  
μA  
RRM  
Device mounted on a ceramic board  
Board size: 50 mm × 50 mm  
Soldering land: 2 mm × 2 mm  
Board thickness: 0.64 mm  
⎯
⎯
65  
R
°C/W  
th (j-a)  
Device mounted on a glass-epoxy board  
Board size: 50 mm × 50 mm  
Soldering land: 6 mm × 6 mm  
Board thickness: 1.6 mm  
⎯
⎯
⎯
⎯
130  
20  
R
th (j-ℓ)  
―
°C/W  
2008-02-01  
1
1234

中文翻译

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