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CMLDM7003JETR PDF预览

CMLDM7003JETR

更新时间: 2024-11-24 05:48:35
品牌 Logo 应用领域
CENTRAL /
页数 文件大小 规格书
4页 728K
描述
Power Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET

CMLDM7003JETR 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:,Reach Compliance Code:compliant
风险等级:5.84最大漏极电流 (Abs) (ID):0.28 A
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-609代码:e3
湿度敏感等级:1工作模式:ENHANCEMENT MODE
最高工作温度:150 °C极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):0.35 W子类别:FET General Purpose Power
表面贴装:YES端子面层:Matte Tin (Sn)

CMLDM7003JETR 数据手册

 浏览型号CMLDM7003JETR的Datasheet PDF文件第2页浏览型号CMLDM7003JETR的Datasheet PDF文件第3页浏览型号CMLDM7003JETR的Datasheet PDF文件第4页 
CMLDM7003E  
CMLDM7003JE  
ENHANCED SPECIFICATION  
SURFACE MOUNT SILICON  
DUAL N-CHANNEL  
www.centralsemi.com  
DESCRIPTION:  
The CENTRAL SEMICONDUCTOR CMLDM7003E  
and CMLDM7003JE are dual N-Channel enhancement-  
mode MOSFETs, manufactured by the N-Channel  
DMOS Process, designed for high speed pulsed  
amplifier and driver applications. The CMLDM7003E  
utilizes the USA pinout configuration, while the  
CMLDM7003JE utilizes the Japanese pinout  
ENHANCEMENT-MODE  
MOSFETS  
configuration. These special dual transistor devices  
offer low drain-source on state resistance (r  
and ESD protection up to 2kV.  
)
DS(ON)  
SOT-563 CASE  
MARKING CODES: CMLDM7003E: C73  
CMLDM7003JE: C7J  
FEATURES  
• ESD protected up to 2kV  
MAXIMUM RATINGS: (T =25°C)  
Drain-Source Voltage  
SYMBOL  
UNITS  
A
V
50  
50  
V
V
V
DS  
DG  
GS  
Drain-Gate Voltage  
V
V
Gate-Source Voltage  
12  
Continuous Drain Current  
Maximum Pulsed Drain Current  
Power Dissipation (Note 1)  
Power Dissipation (Note 2)  
Power Dissipation (Note 3)  
Operating and Storage Junction Temperature  
Thermal Resistance  
I
280  
mA  
A
D
I
1.5  
DM  
P
P
P
350  
mW  
mW  
mW  
°C  
D
D
D
300  
150  
T , T  
-65 to +150  
357  
J
stg  
Θ
°C/W  
JA  
ELECTRICAL CHARACTERISTICS PER TRANSISTOR: (T =25°C unless otherwise noted)  
A
SYMBOL  
TEST CONDITIONS  
MIN  
TYP  
MAX  
50  
UNITS  
nA  
I
I
I
I
I
V
V
V
V
V
V
V
V
V
V
V
V
V
V
=5.0V  
=10V  
=12V  
GSSF, GSSR  
GS  
GS  
GS  
DS  
GS  
I
0.5  
1.0  
50  
μA  
μA  
nA  
V
GSSF, GSSR  
I
GSSF, GSSR  
=50V, V =0  
GS  
DSS  
BV  
=0, I =10μA  
50  
DSS  
GS(th)  
SD  
D
V
V
r  
r  
r  
=V , I =250μA  
0.49  
1.2  
1.4  
2.3  
1.9  
1.5  
V
DS GS  
D
=0, I =115mA  
V
GS  
GS  
GS  
GS  
DS  
DS  
DS  
DS  
S
=1.8V, I =50mA  
1.6  
1.3  
1.1  
Ω
DS(ON)  
DS(ON)  
DS(ON)  
D
=2.5V, I =50mA  
Ω
D
=5.0V, I =50mA  
Ω
D
g
=10V, I =200mA  
200  
mS  
pF  
pF  
pF  
FS  
D
C
=25V, V =0, f=1.0MHz  
5.0  
50  
25  
rss  
iss  
GS  
C
=25V, V =0, f=1.0MHz  
GS  
=25V, V =0, f=1.0MHz  
C
oss  
GS  
Enhanced specification  
Notes: (1) Ceramic or aluminum core PC Board with copper mounting pad area of 4.0mm2  
(2) FR-4 Epoxy PC Board with copper mounting pad area of 4.0mm2  
(3) FR-4 Epoxy PC Board with copper mounting pad area of 1.4mm2  
R5 (8-June 2015)  

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