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CMLDM7003TGBKPBFREE PDF预览

CMLDM7003TGBKPBFREE

更新时间: 2024-11-20 09:59:07
品牌 Logo 应用领域
CENTRAL /
页数 文件大小 规格书
2页 566K
描述
Power Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET,

CMLDM7003TGBKPBFREE 数据手册

 浏览型号CMLDM7003TGBKPBFREE的Datasheet PDF文件第2页 
CMLDM7003TG  
SURFACE MOUNT  
DUAL N-CHANNEL  
ENHANCEMENT-MODE  
SILICON MOSFET  
www.centralsemi.com  
DESCRIPTION:  
The CENTRAL SEMICONDUCTOR CMLDM7003TG  
is a dual Enhancement-mode N-Channel MOSFET,  
manufactured by the N-Channel DMOS Process,  
designed for high speed pulsed amplifier and driver  
applications. This device offers low r  
, low  
DS(ON)  
V
and ESD protection up to 2kV.  
GS(th),  
MARKING CODE: CTG  
SOT-563 CASE  
Device is Halogen Free by design  
MAXIMUM RATINGS: (T =25°C)  
Drain-Source Voltage  
SYMBOL  
UNITS  
V
A
V
50  
50  
DS  
DG  
GS  
Drain-Gate Voltage  
V
V
V
V
Gate-Source Voltage  
12  
Continuous Drain Current  
Maximum Pulsed Drain Current  
Power Dissipation (Note 1)  
Power Dissipation (Note 2)  
Power Dissipation (Note 3)  
Operating and Storage Junction Temperature  
Thermal Resistance  
I
280  
mA  
A
D
I
1.5  
DM  
P
P
P
350  
mW  
mW  
mW  
°C  
D
D
D
300  
150  
T , T  
-65 to +150  
357  
J
stg  
Θ
°C/W  
JA  
ELECTRICAL CHARACTERISTICS PER TRANSISTOR: (T =25°C unless otherwise noted)  
A
SYMBOL  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
I
I
I
I
, I  
V
V
V
V
V
V
V
V
V
V
V
V
V
V
=5.0V  
=10V  
=12V  
50  
nA  
GSSF GSSR  
GS  
GS  
GS  
DS  
GS  
, I  
GSSF GSSR  
0.5  
1.0  
50  
μA  
μA  
nA  
V
, I  
GSSF GSSR  
=50V, V =0  
GS  
DSS  
BV  
=0, I =10μA  
50  
DSS  
GS(th)  
SD  
D
V
V
=V , I =250μA  
0.7  
1.2  
1.4  
2.3  
1.9  
1.5  
V
DS GS  
D
=0, I =115mA  
V
GS  
GS  
GS  
GS  
DS  
DS  
DS  
DS  
S
r
r
r
=1.8V, I =50mA  
1.6  
1.3  
1.1  
Ω
DS(ON)  
DS(ON)  
DS(ON)  
D
=2.5V, I =50mA  
Ω
D
=5.0V, I =50mA  
Ω
D
g
=10V, I =200mA  
200  
mS  
pF  
pF  
pF  
FS  
D
C
C
C
=25V, V =0, f=1.0MHz  
5.0  
50  
25  
rss  
iss  
GS  
=25V, V =0, f=1.0MHz  
GS  
=25V, V =0, f=1.0MHz  
oss  
GS  
Notes: (1) Ceramic or aluminum core PC Board with copper mounting pad area of 4.0mm2  
(2) FR-4 Epoxy PC Board with copper mounting pad area of 4.0mm2  
(3) FR-4 Epoxy PC Board with copper mounting pad area of 1.4mm2  
R2 (15-April 2010)  

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