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CC2560-SN2100 PDF预览

CC2560-SN2100

更新时间: 2024-02-02 05:33:36
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描述
Bluetooth Class 1 Module from Murata

CC2560-SN2100 数据手册

 浏览型号CC2560-SN2100的Datasheet PDF文件第2页 
CC2560-SN2100  
www.ti.com  
SWRS131 OCTOBER 2012  
Bluetooth® Class 1 Module from Murata  
1
FEATURES  
23  
2.4 GHz Bluetooth v2 Class 1  
APPLICATIONS  
Antenna: On-board Chip Antenna  
Dimensions: 17.5 mm x 16 mm x 2 mm  
Transmit Output Power: +18 dBm  
Receive Sensitivity: –92 dBm  
Data Rate Support: BDR  
Home Automation  
Home Energy Management System  
Industrial Control and Monitoring  
Healthcare and Fitness Device  
Supply Voltage: 2.2 V to 3.3 V  
32 kHz Clock Circuit: On-module  
Host Interface: UART  
Operating Temperature: –40ºC to 85ºC  
RoHS Compliant  
MSL Level 3  
FCC, IC certified, CE compliant  
DESCRIPTION  
SN2100 is a complete industrial grade high power (class 1) Bluetooth® module with on-board antenna for M2M  
application. It integrates Bluetooth® IC, PA, RF front end, TCXO and chip antenna into a small LGA form factor  
and can be simply dropped into the OEM’s design. The SN2100 offers total 110 dB link budget, which is  
significantly better than most of the Bluetooth® modules do in the market. This makes it a good fit for industrial  
control application that usually requires longer distance coverage. The module offers extended product life and  
industrial standard operating temperature range to fit the industrial usage. The module offers standard HCI  
interface to the host CPU.  
More information on the product can be found on Murata's website:  
Product Overview:http://www.murata-ws.com/sn2100.htm  
Data sheet:  
http://www.murata-ws.com/view.php?http://www.murata-ws.com/datastore/media/bt_sn2100_ds.pdf  
More information on TI’s wireless platform solutions for Bluetooth can be found on TI's Wireless Connectivity Wiki  
(www.ti.com/connectivitywiki).  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
3
Bluetooth is a registered trademark of Bluetooth SIG, Inc.  
All other trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2012, Texas Instruments Incorporated  

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