5秒后页面跳转
捷配首页

Datasheet > 电信电路 > 其他电信集成电路> CC2564BRVMT
CC2564BRVMT PDF预览

CC2564BRVMT

更新时间： 2024-02-20 00:42:15
品牌 Logo 应用领域
德州仪器 - TI 电信集成电路电信电路控制器蓝牙
页数 文件大小 规格书
51页 1044K
描述
Bluetooth and Dual-Mode Controller

阅读下载

中文翻译

获取价格

CC2564BRVMT 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Not Recommended包装说明：BGA,
Reach Compliance Code：compliantHTS代码：8542.39.00.01
风险等级：7.43JESD-30 代码：R-PBGA-B54
JESD-609代码：e1湿度敏感等级：1
功能数量：1端子数量：54
最高工作温度：85 °C最低工作温度：-40 °C
封装主体材料：PLASTIC/EPOXY封装代码：BGA
封装形状：RECTANGULAR封装形式：GRID ARRAY
标称供电电压：3.6 V表面贴装：YES
电信集成电路类型：TELECOM CIRCUIT温度等级：INDUSTRIAL
端子面层：Tin/Silver/Copper (Sn/Ag/Cu)端子形式：BALL
端子位置：BOTTOMBase Number Matches：1

CC2564BRVMT 数据手册

 浏览型号CC2564BRVMT的Datasheet PDF文件第2页浏览型号CC2564BRVMT的Datasheet PDF文件第3页浏览型号CC2564BRVMT的Datasheet PDF文件第4页浏览型号CC2564BRVMT的Datasheet PDF文件第5页浏览型号CC2564BRVMT的Datasheet PDF文件第6页浏览型号CC2564BRVMT的Datasheet PDF文件第7页 
CC256x  
www.ti.com  
SWRS121C –JULY 2012–REVISED OCTOBER 2013  
Bluetooth® and Dual-Mode Controller  
1 Bluetooth and Dual-Mode Controller  
– Package Footprint: 76 Pins, 0.6-mm Pitch,  
8.10-mm- x 8.10-mm mrQFN  
• Best-in-Class Bluetooth (RF) Performance (TX  
1.1 Features  
123456  
• Single-Chip Bluetooth Solution Integrating  
Bluetooth Basic Rate (BR)/Enhanced Data Rate  
(EDR)/Low Energy (LE) Features Fully  
Compliant With the Bluetooth 4.0 Specification  
Up to the HCI Layer  
Power, RX Sensitivity, Blocking)  
– Class 1.5 TX Power Up to +12 dBm  
– Internal Temperature Detection and  
Compensation to Ensure Minimal Variation  
in RF Performance Over Temperature, No  
External Calibration Required  
– Improved Adaptive Frequency Hopping  
(AFH) Algorithm With Minimum Adaptation  
Time  
• BR/EDR Features Include:  
– Up to 7 Active Devices  
– Scatternet: Up to 3 Piconets Simultaneously,  
1 as Master and 2 as Slaves  
– Up to 2 SCO Links on the Same Piconet  
– Support for All Voice Air-Coding –  
– Provides Longer Range, Including 2x Range  
Over Other BLE-Only Solutions  
• Advanced Power Management for Extended  
Battery Life and Ease of Design:  
Continuously Variable Slope Delta (CVSD),  
A-Law, μ-Law, and Transparent (Uncoded)  
• CC2560B/CC256B Devices Provide an Assisted  
Mode for HFP1.6 Wideband Speech (WBS)  
Profile or A2DP Profile to Reduce Host  
Processing and Power  
– On-Chip Power Management, Including  
Direct Connection to Battery  
– Low Power Consumption for Active,  
Standby, and Scan Bluetooth Modes  
– Shutdown and Sleep Modes to Minimize  
Power Consumption  
• LE Features Include:  
– Support of Up to 6 (CC2564) or 10 (CC2564B)  
Simultaneous Connections  
– Multiple Sniff Instances Tightly Coupled to  
Achieve Minimum Power Consumption  
– Independent Buffering for LE Allows Large  
Numbers of Multiple Connections Without  
Affecting BR/EDR Performance.  
• Physical Interfaces:  
– Standard HCI Over H4 UART With Maximum  
Rate of 4 Mbps Supported by All CC256x  
Members  
– Standard HCI Over H5 UART With Maximum  
Rate of 4 Mbps Supported by CC2560B and  
CC2564B Devices  
– Includes Built-In Coexistence and  
Prioritization Handling for BR/EDR and LE  
• Flexibility for Easy Stack Integration and  
Validation Into Various Microcontrollers, Such  
as MSP430™ and ARM® Cortex™ M3 and M4  
MCUs  
– Fully Programmable Digital PCM-I2S Codec  
Interface  
• CC256x Bluetooth Hardware Evaluation Tool:  
PC-Based Application to Evaluate RF  
Performance of the Device and Configure  
Service Pack  
• Highly Optimized for Low-Cost Designs:  
– Single-Ended 50-Ω RF Interface  
1.2 Applications  
•
•
•
•
•
Mobile phone accessories  
Sports and fitness applications  
Wireless audio solutions  
Remote controls  
Toys  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
3
4
5
6
MSP430 is a trademark of Texas Instruments.  
Cortex is a trademark of ARM Limited.  
ARM7TDMIE is a registered trademark of ARM Limited.  
ARM is a registered trademark of ARM Physical IP, Inc.  
Bluetooth is a registered trademark of Bluetooth SIG, Inc.  
PRODUCTION DATA information is current as of publication date. Products conform to  
specifications per the terms of the Texas Instruments standard warranty. Production  
processing does not necessarily include testing of all parameters.  
Copyright © 2012–2013, Texas Instruments Incorporated  
 
 
 
1234567...51

中文翻译

下载PDF

CC2564BRVMT 替代型号

型号 品牌 替代类型 描述 数据表
CC2564RVMT TI

完全替代

 Bluetooth and Dual-Mode Controller
CC2564RVMR TI

完全替代

 Bluetooth and Dual-Mode Controller
CC2564BRVMR TI

完全替代

 Bluetooth and Dual-Mode Controller

与CC2564BRVMT相关器件

型号 品牌 获取价格 描述 数据表
CC2564C TI

获取价格

 		具有基本速率 (BR)、增强数据速率 (EDR) 和低功耗 (LE) 模块的 Blueto
CC2564CRVMR TI

获取价格

 		具有基本速率 (BR)、增强数据速率 (EDR) 和低功耗 (LE) 模块的 Blueto
CC2564CRVMT TI

获取价格

 		具有基本速率 (BR)、增强数据速率 (EDR) 和低功耗 (LE) 模块的 Blueto
CC2564MODA TI

获取价格

 		具有基本速率、增强数据速率和带集成天线的低功耗 (LE) 模块的 Bluetooth® 4
CC2564MODACMOG TI

获取价格

 		具有基本速率、增强数据速率和带集成天线的低功耗 (LE) 模块的 Bluetooth® 4
CC2564MODN TI

获取价格

 		具有基本速率 (BR)、增强数据速率 (EDR) 和低功耗 (LE) 模块的 Blueto
CC2564MODNCMOER TI

获取价格

 		具有基本速率 (BR)、增强数据速率 (EDR) 和低功耗 (LE) 模块的 Blueto
CC2564MODNCMOET TI

获取价格

 		具有基本速率 (BR)、增强数据速率 (EDR) 和低功耗 (LE) 模块的 Blueto
CC2564NSRVMR TI

获取价格

 		具有增强数据速率 (EDR)、低功耗 (LE) 模块和 ANT 的 Bluetooth®
CC2564NSRVMT TI

获取价格

 		具有增强数据速率 (EDR)、低功耗 (LE) 模块和 ANT 的 Bluetooth®

与CC2564BRVMT相关文章

您还可以找


热门产品
PCB打样/小批量
铝基板
BOM智能配单
PCBA制造
钣金
精密CNC
模具注塑
薄膜开关
精选活动
PCBA打样特惠
四六层板品质升级
铝基板品质升级
一体化电子制造
DFM下载
服务支持
企业认证
产品展示
工厂展示
工艺能力
积分商城
关于捷配
捷配简介
企业文化
公司动态
人才招聘
联系我们
帮助中心
下单流程
付款流程
开票流程
常见问题
全球PCB制造服务专线 400-613-0088

工作时间：9:00-21:00

CEO邮箱：ceo@jiepei.com

投诉邮箱：tousu@jiepei.com

捷配网-微信公众号 微信公众号
捷配网-微信公众号 抖音公众号
资质认证：
合作快递：
支付方式：
Copyright © 2024 Jiepei.com Inc. All Rights Reserved. 版权所有:杭州捷配信息科技有限公司 浙公网安备 33010502006866号 浙ICP备10014259号-119 营业执照ICP证