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CC2564YFVT PDF预览

CC2564YFVT

更新时间： 2024-11-24 19:49:11
品牌 Logo 应用领域
德州仪器 - TI 电信电信集成电路
页数 文件大小 规格书
43页 496K
描述
Bluetooth Controller 54-DSBGA

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CC2564YFVT 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Not Recommended包装说明：BGA,
Reach Compliance Code：compliantHTS代码：8542.39.00.01
风险等级：7.43JESD-30 代码：R-PBGA-B54
JESD-609代码：e1湿度敏感等级：1
功能数量：1端子数量：54
最高工作温度：85 °C最低工作温度：-40 °C
封装主体材料：PLASTIC/EPOXY封装代码：BGA
封装形状：RECTANGULAR封装形式：GRID ARRAY
标称供电电压：3.6 V表面贴装：YES
电信集成电路类型：TELECOM CIRCUIT温度等级：INDUSTRIAL
端子面层：Tin/Silver/Copper (Sn/Ag/Cu)端子形式：BALL
端子位置：BOTTOMBase Number Matches：1

CC2564YFVT 数据手册

 浏览型号CC2564YFVT的Datasheet PDF文件第2页浏览型号CC2564YFVT的Datasheet PDF文件第3页浏览型号CC2564YFVT的Datasheet PDF文件第4页浏览型号CC2564YFVT的Datasheet PDF文件第5页浏览型号CC2564YFVT的Datasheet PDF文件第6页浏览型号CC2564YFVT的Datasheet PDF文件第7页 
CC256x  
www.ti.com  
SWRS121B –JULY 2012–REVISED MAY 2013  
Bluetooth® and Dual Mode Controller  
1 FEATURES  
123456  
• Single-Chip Bluetooth Smart Ready Solution  
Integrating Bluetooth Basic Rate  
• Advanced Power Management for Extended  
Battery Life and Ease of Design:  
(BR)/Enhanced Data Rate (EDR)/Low Energy  
(LE) Features Fully Compliant With the  
Bluetooth 4.0 Specification Up to the HCI Layer  
– On-Chip Power Management, Including  
Direct Connection to Battery  
– Low Power Consumption for Active,  
Standby, and Scan Bluetooth Modes  
– Shutdown and Sleep Modes to Minimize  
Power Consumption  
• BR/EDR Features Include:  
– Up to 7 Active Devices  
– Scatternet: Up to 3 Piconets Simultaneously,  
1 as Master and 2 as Slaves  
• Physical Interfaces:  
– Up to 2 SCO Links on the Same or Different  
Piconets  
– Standard HCI Over H4 UART With Maximum  
Rate of 4 Mbps  
– Support for All Voice Air-Coding –  
– Fully Programmable Digital PCM-I2S™  
Codec Interface  
• CC256x Bluetooth Hardware Evaluation Tool:  
PC-Based Application to Evaluate RF  
Performance of the Device and Configure  
Service Pack  
Continuously Variable Slope Delta (CVSD),  
A-Law, μ-Law, and Transparent (Uncoded)  
• LE Features Include:  
– Supports Up to 6 Simultaneous Connections  
– Multiple Sniff Instances that are Tightly  
Coupled to Achieve Minimum Power  
Consumption  
– Independent Buffering for LE Allows Large  
Numbers of Multiple Connections Without  
Affecting BR/EDR Performance.  
– Includes Built-In Coexistence and  
Prioritization Handling for BR/EDR and LE  
• Flexibility for Easy Stack Integration and  
Validation into Various Microcontrollers, Such  
as MSP430™ and Other MCUs  
• Highly Optimized for Low-Cost Designs:  
– Single-Ended 50-Ω RF Interface  
– Package Footprint: 76 Pins, 0.6-mm Pitch,  
8.10- x 7.83-mm mrQFN  
• Best-in-class Bluetooth (RF) performance (TX  
power, RX sensitivity, blocking)  
– Class 1.5" TX Power Up to +12 dBm  
– Internal Temperature Detection and  
Compensation to Ensure Minimal Variation  
in RF Performance Over Temperature, No  
External Calibration Required  
– Improved Adaptive Frequency Hopping  
(AFH) Algorithm With Minimum Adaptation  
Time  
– Provides Longer Range, Including 2x Range  
Over Other BLE-Only Solutions  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
MSP430 is a trademark of Texas Instruments.  
ARM7TDMIE is a registered trademark of ARM Limited.  
ARM is a registered trademark of ARM Physical IP, Inc.  
2
3
4
5
6
Bluetooth is a registered trademark of Bluetooth SIG, Inc.  
I2S is a trademark of Philips Electronics.  
PRODUCTION DATA information is current as of publication date. Products conform to  
specifications per the terms of the Texas Instruments standard warranty. Production  
processing does not necessarily include testing of all parameters.  
Copyright © 2012–2013, Texas Instruments Incorporated  
 
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CC2564YFVT 替代型号

型号 品牌 替代类型 描述 数据表
CC2564YFVR TI

完全替代

 Bluetooth Controller 54-DSBGA

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