CC256x
www.ti.com
SWRS121C –JULY 2012–REVISED OCTOBER 2013
Bluetooth® and Dual-Mode Controller
1 Bluetooth and Dual-Mode Controller
– Package Footprint: 76 Pins, 0.6-mm Pitch,
8.10-mm- x 8.10-mm mrQFN
• Best-in-Class Bluetooth (RF) Performance (TX
1.1 Features
123456
• Single-Chip Bluetooth Solution Integrating
Bluetooth Basic Rate (BR)/Enhanced Data Rate
(EDR)/Low Energy (LE) Features Fully
Compliant With the Bluetooth 4.0 Specification
Up to the HCI Layer
Power, RX Sensitivity, Blocking)
– Class 1.5 TX Power Up to +12 dBm
– Internal Temperature Detection and
Compensation to Ensure Minimal Variation
in RF Performance Over Temperature, No
External Calibration Required
– Improved Adaptive Frequency Hopping
(AFH) Algorithm With Minimum Adaptation
Time
• BR/EDR Features Include:
– Up to 7 Active Devices
– Scatternet: Up to 3 Piconets Simultaneously,
1 as Master and 2 as Slaves
– Up to 2 SCO Links on the Same Piconet
– Support for All Voice Air-Coding –
– Provides Longer Range, Including 2x Range
Over Other BLE-Only Solutions
• Advanced Power Management for Extended
Battery Life and Ease of Design:
Continuously Variable Slope Delta (CVSD),
A-Law, μ-Law, and Transparent (Uncoded)
• CC2560B/CC256B Devices Provide an Assisted
Mode for HFP1.6 Wideband Speech (WBS)
Profile or A2DP Profile to Reduce Host
Processing and Power
– On-Chip Power Management, Including
Direct Connection to Battery
– Low Power Consumption for Active,
Standby, and Scan Bluetooth Modes
– Shutdown and Sleep Modes to Minimize
Power Consumption
• LE Features Include:
– Support of Up to 6 (CC2564) or 10 (CC2564B)
Simultaneous Connections
– Multiple Sniff Instances Tightly Coupled to
Achieve Minimum Power Consumption
– Independent Buffering for LE Allows Large
Numbers of Multiple Connections Without
Affecting BR/EDR Performance.
• Physical Interfaces:
– Standard HCI Over H4 UART With Maximum
Rate of 4 Mbps Supported by All CC256x
Members
– Standard HCI Over H5 UART With Maximum
Rate of 4 Mbps Supported by CC2560B and
CC2564B Devices
– Includes Built-In Coexistence and
Prioritization Handling for BR/EDR and LE
• Flexibility for Easy Stack Integration and
Validation Into Various Microcontrollers, Such
as MSP430™ and ARM® Cortex™ M3 and M4
MCUs
– Fully Programmable Digital PCM-I2S Codec
Interface
• CC256x Bluetooth Hardware Evaluation Tool:
PC-Based Application to Evaluate RF
Performance of the Device and Configure
Service Pack
• Highly Optimized for Low-Cost Designs:
– Single-Ended 50-Ω RF Interface
1.2 Applications
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Mobile phone accessories
Sports and fitness applications
Wireless audio solutions
Remote controls
Toys
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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MSP430 is a trademark of Texas Instruments.
Cortex is a trademark of ARM Limited.
ARM7TDMIE is a registered trademark of ARM Limited.
ARM is a registered trademark of ARM Physical IP, Inc.
Bluetooth is a registered trademark of Bluetooth SIG, Inc.
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of the Texas Instruments standard warranty. Production
processing does not necessarily include testing of all parameters.
Copyright © 2012–2013, Texas Instruments Incorporated