是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Not Recommended | 零件包装代码: | QFN |
包装说明: | HVQCCN, LCC16,.16SQ,25 | 针数: | 16 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
Factory Lead Time: | 1 week | 风险等级: | 7.8 |
数据速率: | 250 Mbps | JESD-30 代码: | S-PQCC-N16 |
JESD-609代码: | e4 | 长度: | 4 mm |
湿度敏感等级: | 3 | 功能数量: | 1 |
端子数量: | 16 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | HVQCCN | 封装等效代码: | LCC16,.16SQ,25 |
封装形状: | SQUARE | 封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度): | 260 | 电源: | 1.8/3.6 V |
认证状态: | Not Qualified | 座面最大高度: | 0.95 mm |
子类别: | Other Telecom ICs | 最大压摆率: | 0.0228 mA |
标称供电电压: | 3 V | 表面贴装: | YES |
技术: | CMOS | 电信集成电路类型: | TELECOM CIRCUIT |
温度等级: | INDUSTRIAL | 端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式: | NO LEAD | 端子节距: | 0.65 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 4 mm | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
CC2550RSTG3 | TI |
完全替代 |
Low Cost 2.4 GHz Transmitter Designed for Low-Power Wireless Applications in 2.4 GHz ISM B | |
CC2550-RTY1 | TI |
完全替代 |
Single Chip Low Cost Low Power RF Transmitter | |
CC2550-RTR1 | TI |
完全替代 |
Single Chip Low Cost Low Power RF Transmitter |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
CC2550RTK | TI |
获取价格 |
Single Chip Low Cost Low Power RF Transmitter | |
CC2550RTKR | TI |
获取价格 |
Single Chip Low Cost Low Power RF Transmitter | |
CC2550-RTR1 | TI |
获取价格 |
Single Chip Low Cost Low Power RF Transmitter | |
CC2550-RTY1 | TI |
获取价格 |
Single Chip Low Cost Low Power RF Transmitter | |
CC2560 | TI |
获取价格 |
Bluetooth? Wireless Kit | |
CC2560ARVMR | TI |
获取价格 |
Bluetooth and Dual-Mode Controller | |
CC2560ARVMT | TI |
获取价格 |
Bluetooth and Dual-Mode Controller | |
CC2560BRVMR | TI |
获取价格 |
Bluetooth and Dual-Mode Controller | |
CC2560BRVMT | TI |
获取价格 |
Bluetooth and Dual-Mode Controller | |
CC2560-PAN1315 | TI |
获取价格 |
Bluetooth® v2.1 Enhanced Data Rate (EDR) Mo |