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CC2560ARVMT PDF预览

CC2560ARVMT

更新时间： 2024-01-21 21:15:37
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德州仪器 - TI 控制器蓝牙
页数 文件大小 规格书
51页 1044K
描述
Bluetooth and Dual-Mode Controller

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CC2560ARVMT 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：VFBGA,
Reach Compliance Code：compliantFactory Lead Time：6 weeks
风险等级：5.33JESD-30 代码：R-XBGA-B54
JESD-609代码：e1长度：3.265 mm
湿度敏感等级：1功能数量：1
端子数量：54最高工作温度：85 °C
最低工作温度：-40 °C封装主体材料：UNSPECIFIED
封装代码：VFBGA封装形状：RECTANGULAR
封装形式：GRID ARRAY, VERY THIN PROFILE, FINE PITCH峰值回流温度（摄氏度）：NOT SPECIFIED
座面最大高度：0.575 mm标称供电电压：3.6 V
表面贴装：YES电信集成电路类型：TELECOM CIRCUIT
温度等级：INDUSTRIAL端子面层：Tin/Silver/Copper (Sn/Ag/Cu)
端子形式：BALL端子节距：0.4 mm
端子位置：BOTTOM处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：2.925 mmBase Number Matches：1

CC2560ARVMT 数据手册

 浏览型号CC2560ARVMT的Datasheet PDF文件第2页浏览型号CC2560ARVMT的Datasheet PDF文件第3页浏览型号CC2560ARVMT的Datasheet PDF文件第4页浏览型号CC2560ARVMT的Datasheet PDF文件第5页浏览型号CC2560ARVMT的Datasheet PDF文件第6页浏览型号CC2560ARVMT的Datasheet PDF文件第7页 
CC256x  
www.ti.com  
SWRS121C –JULY 2012–REVISED OCTOBER 2013  
Bluetooth® and Dual-Mode Controller  
1 Bluetooth and Dual-Mode Controller  
– Package Footprint: 76 Pins, 0.6-mm Pitch,  
8.10-mm- x 8.10-mm mrQFN  
• Best-in-Class Bluetooth (RF) Performance (TX  
1.1 Features  
123456  
• Single-Chip Bluetooth Solution Integrating  
Bluetooth Basic Rate (BR)/Enhanced Data Rate  
(EDR)/Low Energy (LE) Features Fully  
Compliant With the Bluetooth 4.0 Specification  
Up to the HCI Layer  
Power, RX Sensitivity, Blocking)  
– Class 1.5 TX Power Up to +12 dBm  
– Internal Temperature Detection and  
Compensation to Ensure Minimal Variation  
in RF Performance Over Temperature, No  
External Calibration Required  
– Improved Adaptive Frequency Hopping  
(AFH) Algorithm With Minimum Adaptation  
Time  
• BR/EDR Features Include:  
– Up to 7 Active Devices  
– Scatternet: Up to 3 Piconets Simultaneously,  
1 as Master and 2 as Slaves  
– Up to 2 SCO Links on the Same Piconet  
– Support for All Voice Air-Coding –  
– Provides Longer Range, Including 2x Range  
Over Other BLE-Only Solutions  
• Advanced Power Management for Extended  
Battery Life and Ease of Design:  
Continuously Variable Slope Delta (CVSD),  
A-Law, μ-Law, and Transparent (Uncoded)  
• CC2560B/CC256B Devices Provide an Assisted  
Mode for HFP1.6 Wideband Speech (WBS)  
Profile or A2DP Profile to Reduce Host  
Processing and Power  
– On-Chip Power Management, Including  
Direct Connection to Battery  
– Low Power Consumption for Active,  
Standby, and Scan Bluetooth Modes  
– Shutdown and Sleep Modes to Minimize  
Power Consumption  
• LE Features Include:  
– Support of Up to 6 (CC2564) or 10 (CC2564B)  
Simultaneous Connections  
– Multiple Sniff Instances Tightly Coupled to  
Achieve Minimum Power Consumption  
– Independent Buffering for LE Allows Large  
Numbers of Multiple Connections Without  
Affecting BR/EDR Performance.  
• Physical Interfaces:  
– Standard HCI Over H4 UART With Maximum  
Rate of 4 Mbps Supported by All CC256x  
Members  
– Standard HCI Over H5 UART With Maximum  
Rate of 4 Mbps Supported by CC2560B and  
CC2564B Devices  
– Includes Built-In Coexistence and  
Prioritization Handling for BR/EDR and LE  
• Flexibility for Easy Stack Integration and  
Validation Into Various Microcontrollers, Such  
as MSP430™ and ARM® Cortex™ M3 and M4  
MCUs  
– Fully Programmable Digital PCM-I2S Codec  
Interface  
• CC256x Bluetooth Hardware Evaluation Tool:  
PC-Based Application to Evaluate RF  
Performance of the Device and Configure  
Service Pack  
• Highly Optimized for Low-Cost Designs:  
– Single-Ended 50-Ω RF Interface  
1.2 Applications  
•
•
•
•
•
Mobile phone accessories  
Sports and fitness applications  
Wireless audio solutions  
Remote controls  
Toys  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
3
4
5
6
MSP430 is a trademark of Texas Instruments.  
Cortex is a trademark of ARM Limited.  
ARM7TDMIE is a registered trademark of ARM Limited.  
ARM is a registered trademark of ARM Physical IP, Inc.  
Bluetooth is a registered trademark of Bluetooth SIG, Inc.  
PRODUCTION DATA information is current as of publication date. Products conform to  
specifications per the terms of the Texas Instruments standard warranty. Production  
processing does not necessarily include testing of all parameters.  
Copyright © 2012–2013, Texas Instruments Incorporated  
 
 
 
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