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C505RT230-S0200 PDF预览

C505RT230-S0200

更新时间: 2024-02-23 22:00:47
品牌 Logo 应用领域
MARKTECH 光电
页数 文件大小 规格书
4页 264K
描述
RazerThin LEDs

C505RT230-S0200 技术参数

生命周期:Active包装说明:0.20 X 0.20 MM, DIE-2
Reach Compliance Code:unknownHTS代码:8541.40.20.00
风险等级:5.77颜色:GREEN
颜色@波长:Blue-Green配置:SINGLE
最大正向电流:0.03 A最大正向电压:3.7 V
安装特点:SURFACE MOUNT功能数量:1
端子数量:1最高工作温度:100 °C
最低工作温度:-40 °C光电设备类型:SINGLE COLOR LED
包装方法:BULK最大反向电压:5 V
形状:SQUARE子类别:Visible LEDs
表面贴装:YESBase Number Matches:1

C505RT230-S0200 数据手册

 浏览型号C505RT230-S0200的Datasheet PDF文件第2页浏览型号C505RT230-S0200的Datasheet PDF文件第3页浏览型号C505RT230-S0200的Datasheet PDF文件第4页 
®
RazerThin LEDs  
CxxxRT230-S0200  
Cree’s RazerThin LEDs combine highly efficient InGaN materials with Cree’s proprietary G•SiC® substrate to deliver  
superior price/performance for blue and green LEDs. These vertically structured LED chips are small in size and  
require a low forward voltage. Cree’s RT series chips are tested for conformity to optical and electrical specifications  
and the ability to withstand 1000 V ESD. Applications include keypad backlighting where sub-miniaturization and  
thinner form factors are required.  
FEATURES  
APPLICATIONS  
Small Chip - 200 x 200 x 85 μm  
Low Forward Voltage  
Mobile Phone Key Pads  
Blue LEDs  
3.1 V Typical at 20 mA - Blue & Traffic Green  
3.2 V Typical at 20 mA Green  
White LEDs  
Audio Product Display Lighting  
Mobile Appliance Keypads  
RT230™ LED Performance  
2.0 mW min. Blue  
1.5 mW min. Green  
Automobile Dashboard Lighting  
Single Wire Bond Structure  
Class 2 ESD Rating  
CxxxRT230-S0200 Chip Diagram  
Top View  
Bottom View  
Side View  
G•SiC® LED Chip  
200 x 200 μm  
InGaN  
Anode (+)  
Mesa (junction)  
176 x 176 μm  
SiC Substrate  
h = 85 μm  
Gold Bond Pad  
105 μm Diameter  
Cathode (-)  
Backside  
Metallization  
80 x 80 μm  
Subject to change without notice.  
www.cree.com  

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