C505XB900-S6000-A

更新时间： 2024-01-10 13:37:45

品牌	Logo	应用领域
科锐 - CREE		/
页数	文件大小	规格书
4页	253K
描述
XBright㈢ Power Chip LED

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XBright Power Chip LED

CxxxXB900-Sx000-A

Cree’s XB™ power chip series of LEDs are the next generation of solid-state LED emitters that combine highly efﬁcient

InGaN materials with Cree’s proprietary G•SiC^®substrate to deliver superior price/performance for high-intensity

LEDs. These LED chips have a geometrically enhanced Epi-down design to maximize light extraction efﬁciency and

require only a single wire bond connection. These LEDs are useful in a broad range of applications such as outdoor

full-motion LED video signs, automotive lighting and white LEDs. Cree’s XB power chips are compatible with optical

power packages that employ proper thermal management.

FEATURES

APPLICATIONS

•

XBright LED Technology

•

General Illumination

Larger “Power Chip” Design

High Performance

–

Automobile

Aircraft

–

90 mW min. (460 & 470 nm) Blue

60 mW min. (505 nm) Trafﬁc Green

40 mW min. (527 nm) Green

Decorative Lighting

Task Lighting

Outdoor Illumination

•

Single Wire Bond Structure

AuSn Backside Metalization

•

White LEDs

Backlighting

Trafﬁc Signals

CxxxXB900-Sx000-A Chip Diagram

Top View

Bottom View

Die Cross Section

G•SiC LED Chip

900 x 900 μm

764 μm

Contact Metal

Cathode (-)

Width = 30 μm

SiC Substrate

h = 250 μm

Bond Pad

120 μm Diameter

InGaN

Anode (+)

Subject to change without notice.

www.cree.com

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