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BSM75GB120DN2 PDF预览

BSM75GB120DN2

更新时间: 2024-11-16 09:00:27
品牌 Logo 应用领域
EUPEC 晶体晶体管功率控制双极性晶体管局域网
页数 文件大小 规格书
10页 255K
描述
IGBT Power Module

BSM75GB120DN2 技术参数

生命周期:Transferred包装说明:FLANGE MOUNT, R-XUFM-X7
Reach Compliance Code:unknown风险等级:5.59
Is Samacsys:N外壳连接:ISOLATED
最大集电极电流 (IC):75 A集电极-发射极最大电压:1200 V
配置:SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE门极-发射极最大电压:20 V
JESD-30 代码:R-XUFM-X7元件数量:2
端子数量:7最高工作温度:150 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:FLANGE MOUNT极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):625 W认证状态:Not Qualified
子类别:Insulated Gate BIP Transistors表面贴装:NO
端子形式:UNSPECIFIED端子位置:UPPER
晶体管应用:POWER CONTROL晶体管元件材料:SILICON
标称断开时间 (toff):520 ns标称接通时间 (ton):100 ns
VCEsat-Max:3.2 VBase Number Matches:1

BSM75GB120DN2 数据手册

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BSM 75 GB 120 DN2  
IGBT Power Module  
• Half-bridge  
• Including fast free-wheeling diodes  
• Package with insulated metal base plate  
Type  
V
I
Package  
Ordering Code  
CE  
C
BSM 75 GB 120 DN2  
1200V 105A HALF-BRIDGE 1  
C67076-A2106-A70  
Maximum Ratings  
Parameter  
Symbol  
Values  
Unit  
Collector-emitter voltage  
Collector-gate voltage  
V
V
1200  
V
CE  
CGR  
R
= 20 kW  
1200  
± 20  
GE  
Gate-emitter voltage  
DC collector current  
V
GE  
I
A
C
T = 25 °C  
105  
75  
C
T = 80 °C  
C
Pulsed collector current, t = 1 ms  
I
p
Cpuls  
T = 25 °C  
210  
150  
C
T = 80 °C  
C
Power dissipation per IGBT  
P
W
tot  
T = 25 °C  
625  
C
Chip temperature  
T
T
+ 150  
°C  
j
Storage temperature  
-40 ... + 125  
stg  
£
£
Thermal resistance, chip case  
Diode thermal resistance, chip case  
Insulation test voltage, t = 1min.  
Creepage distance  
R
R
0.2  
0.5  
K/W  
thJC  
thJC  
is  
D
V
-
2500  
Vac  
mm  
20  
Clearance  
-
11  
DIN humidity category, DIN 40 040  
IEC climatic category, DIN IEC 68-1  
-
F
sec  
-
40 / 125 / 56  
1
Oct-21-1997  

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