Datasheet > BPW729-0730-27AB95L

BPW729-0730-27AB95L

更新时间： 2024-10-29 04:13:23

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ACTEL		/
页数	文件大小	规格书
8页	1409K
描述
IC Socket, BGA729, 729 Contact(s), ROHS COMPLIANT

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Socket Mounting Recommendations and Reflow Profile

Stencil

Table 1 shows the recommended stencil dimensions. A laser-cut, electro-polished and Ni-plated

stainless steel stencil is recommended to give the most consistent paste release. The apertures

can be made round except for smaller pitches, where square apertures are recommended.

Remember to keep the stencil small enough to fit within the keep-out area of the socket, but yet

have provisions to remove it from the PCB once the paste has been applied.

Table 1: Recommended stencil dimensions.

Device Pitch

(mm)

1.27

PCB Pad Diameter

(mm / in)

Stencil Thickness

(mm/in)

Stencil Aperture

(mm/in)

min. 0.60 / 0.023

min. 0.50 / 0.019

min. 0.40 / 0.016

min. 0.35 / 0.014

min. 0.30 / 0.012

0.15 / 0.006

0.13 / 0.005

round 0.66 / 0.026

round 0.55 / 0.022

round 0.44 / 0.017

square 0.39 / 0.015

square 0.33 / 0.013

1.00

0.80

0.75

0.65

0.50

Solder Paste

E-tec recommends using solder paste without ( or <0.5%) silver (Ag) to reduce the solder’s

wetting ability and prevent the paste from running up the pins, thus maximizing the volume of

solder left on the pads. Brands such as Qualitek (www.qualitek.com) or Alpha Metals

(www.alphametals.com) produce such solder paste on customer request. For Sn/Pb solder paste

we recommend Ecorel 803S offered by Avantec (www.avantec.dehon.com).

Reflow Profile

Both standard Sn-Pb eutectic and Pb-free reflow profiles are shown below.

E-tec Interconnect Ltd, Industrial Zone C, CH-1072 Forel (Lavaux), Switzerland

Phone +41-21-781 08 10 · www.e-tec.com · info@e-tec.com

E-tec Socket Mounting Recommendations

PRELIMINARY

1 2 345 6 7 8

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