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BPW729-0730-27AB95L PDF预览

BPW729-0730-27AB95L

更新时间: 2024-10-29 04:13:23
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页数 文件大小 规格书
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描述
IC Socket, BGA729, 729 Contact(s), ROHS COMPLIANT

BPW729-0730-27AB95L 数据手册

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Socket Mounting Recommendations and Reflow Profile  
Purpose  
This document is meant to serve as a guide for mounting E-tec surface mount device (SMD)  
sockets to the printed circuit board (PCB). The recommendations described here are guidelines  
only, and modifications may be needed for your particular socket, PCB, and process.  
Application  
The sockets this document applies to are as follows: Clam Shell, Knob Lock, Screw Lock, Twist  
Lock, Quick Lock and Lever Lock in SMD style. These sockets utilize the E-tec patented spring-  
pin technology. This technology allows the pins to be soldered to the PCB while still providing  
compliance to the device under test (DUT) via springs located at the other end of the pin. The  
pins themselves do not have solder pre-forms as a BGA would with its solder balls. However, the  
sockets are designed to mount to the same PCB footprint and pads as required by the BGA, or  
any other IC package the socket was designed for (except if locating pegs are used; see ‘Locating  
Pegs’ section of this document). When compared to mounting a BGA, an extra volume of solder  
paste is required to mount the sockets to the PCB. To effect this, a properly dimensioned stencil  
is required. Once the paste has been applied, a standard reflow process is then used to solder the  
socket to the PCB. After the socket is verified to have proper electrical connection to the PCB,  
the system is then ready to be used.  
Locating Pegs  
Although designed to mount to the same footprint as the IC, with just a small amount of  
additional keep-out area, E-tec sockets can also be offered with locating pegs. The sockets are  
typically mounted with two locating pegs, which require two thru-holes drilled into the PCB.  
These pegs help to align the socket on the PCB, and hence align the socket’s pins to the PCB’s  
pads, during the soldering process. Furthermore, plating the thru-holes allows the locating pegs  
to be soldered to the PCB for better mechanical stability during everyday use and handling of the  
socket. If the PCB design permits, E-tec recommends the use of these locating pegs. For fine-  
pitch, low pin-count sockets without locating pegs, the mechanical strength of the solder joints  
may be insufficient. In these cases, it is recommended to epoxy the socket body to the PCB. 3M  
Scotch-Weld 2216 B/A is a suitable epoxy. In any case, the proper volume of solder paste is  
required to ensure mechanical and electrical integrity. Recommended stencil dimensions are  
given in the next section of this document.  
E-tec Interconnect Ltd, Industrial Zone C, CH-1072 Forel (Lavaux), Switzerland  
Phone +41-21-781 08 10 · www.e-tec.com · info@e-tec.com  
1
E-tec Socket Mounting Recommendations  
PRELIMINARY  

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