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BD2320EFJ-LA PDF预览

BD2320EFJ-LA

更新时间： 2023-09-03 20:25:02
品牌 Logo 应用领域
罗姆 - ROHM 栅极驱动二极管驱动器
页数 文件大小 规格书
21页 1127K
描述
本产品面向工业设备市场、可保证长期稳定供货。是适合这些用途的产品。BD2320EFJ-LA是可驱动使用阴极负载方式的外接Nch-FET的100V耐压高边/低边栅极驱动器。内置100V耐压自举二极管，输入逻辑电源电压可使用3.3V及5.0V两种。作为保护功能，高边及低边搭载低电压误动作防止电路(UVLO)。

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BD2320EFJ-LA 数据手册

 浏览型号BD2320EFJ-LA的Datasheet PDF文件第1页浏览型号BD2320EFJ-LA的Datasheet PDF文件第2页浏览型号BD2320EFJ-LA的Datasheet PDF文件第4页浏览型号BD2320EFJ-LA的Datasheet PDF文件第5页浏览型号BD2320EFJ-LA的Datasheet PDF文件第6页浏览型号BD2320EFJ-LA的Datasheet PDF文件第7页 
BD2320EFJ-LA BD2320UEFJ-LA  
Absolute Maximum Rating (Ta = 25 °C)  
Parameter  
VB - VS Voltage  
Symbol  
Rating  
Unit  
VBS  
VVB  
-0.3 to +15  
-0.3 to +100  
-15 to +100  
VVS-0.3 to VVB+0.3  
-0.3 to +15  
V
V
Voltage on VB  
Voltage on VS  
VVS  
V
Voltage on HO  
VHO  
V
VCC Voltage  
VCC  
V
Voltage on LO  
VLO  
-0.3 to VCC+0.3  
-0.3 to VCC+0.3  
-50 to +50  
V
Voltage on HIN and LIN  
Voltage Slew Rate on VB, VS  
Maximum Junction Temperature  
Storage Temperature Range  
VHIN, VLIN  
SR  
V
V/ns  
°C  
°C  
Tjmax  
150  
Tstg  
-55 to +150  
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit  
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is  
operated over the absolute maximum ratings.  
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the  
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing  
board size and copper area so as not to exceed the maximum junction temperature rating.  
Thermal Resistance (Note 1)  
Thermal Resistance (Typ)  
Parameter  
Symbol  
Unit  
1s(Note 3)  
2s2p(Note 4)  
HTSOP-J8  
Junction to Ambient  
Junction to Top Characterization Parameter(Note 2)  
θJA  
206.4  
21  
45.2  
13  
°C/W  
°C/W  
ΨJT  
(Note 1) Based on JESD51-2A (Still-Air).  
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface  
of the component package.  
(Note 3) Using a PCB board based on JESD51-3.  
(Note 4) Using a PCB board based on JESD51-5, 7.  
Layer Number of  
Measurement Board  
Material  
FR-4  
Board Size  
Single  
114.3 mm x 76.2 mm x 1.57 mmt  
Top  
Copper Pattern  
Thickness  
70 μm  
Footprints and Traces  
Layer Number of  
Measurement Board  
Thermal Via(Note 5)  
Material  
FR-4  
Board Size  
114.3 mm x 76.2 mm x 1.6 mmt  
2 Internal Layers  
Pitch  
Diameter  
4 Layers  
1.20 mm  
Φ0.30 mm  
Top  
Copper Pattern  
Bottom  
Thickness  
70 μm  
Copper Pattern  
Thickness  
35 μm  
Copper Pattern  
Thickness  
70 μm  
Footprints and Traces  
74.2 mm x 74.2 mm  
74.2 mm x 74.2 mm  
(Note 5) This thermal via connects with the copper pattern of all layers.  
Recommended Operating Conditions  
Parameter  
Symbol  
Min  
Typ  
Max  
Unit  
Operating Temperature  
Voltage on VB  
Topr  
VVB  
-40  
-0.3  
-7.0  
7.0  
0
+25  
+125  
+95  
+95  
14.5  
VCC  
°C  
V
-
-
-
-
-
Voltage on VS  
VVS  
V
VB - VS Voltage  
Voltage on HIN LIN  
VCC Voltage  
VBS  
V
VHIN, VLIN  
VCC  
V
7.5  
14.5  
V
www.rohm.com  
© 2020 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0Q2Q0A800840-1-2  
29.Mar.2022 Rev.002  
3/18  
1234567...21

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