BD2326
Triple Band 2‐Way SMT Power Divider
1900~2500MHz PCS, WCDMA & TD‐SCDMA, WiBro
Device Features
Typical Isolaꢀon = 20.0 dB
Typical Inserꢀon Loss = 0.6 dB
MSL 1 moisture raꢀng
Small Size and Low Profile
Lead‐free/RoHS‐compliant SOT‐26 Plasꢀc Package
BD23XX(XX=Wafer number)
Typical Performance1
Product Descripꢀon
Parameter
Min
Typical Max
Unit
MHz
dB
BeRex’s Divider BD2326 is designed for PCS,
WCDMA & TD‐SCDMA and WiBro band with
low Inserꢀon Loss and Isolaꢀon. This chip is
fully passivated for enhanced performance
and reliability and packaged in RoHS‐
compliant with SOT‐26 surface mount pack‐
age.
Frequency Range
Inserꢀon Loss
Isolaꢀon
1900
2500
0.9
0.65
20
15
dB
IRL(S11)
‐15
‐22
0.06
0.8
‐10
‐18
0.2
1.0
dBm
dBm
dB
ORL(S22/S33)
Amplitude Balance
Phase Balance
deg
*All specificaꢀons apply to the following test condiꢀons,
1. Device performance _ measured on BeRex E/B at 25°C, 50ohm system.
2. Inserꢀon Loss: Above 3.0dB.
Applicaꢀons
Absolute Maximum Raꢀngs
Parameter
Input Power
Storage Temperature
Operaꢀng Temperature
Raꢀng
Base staꢀon Infrastructure
1W CW dBm
‐55 to +155°C
‐40 to +85°C
Commercial/Industrial/Military wireless system
Operaꢀon of this device above any of these parameters may result in permanent damage.
Evaluaꢀon Board Drawing
Funcꢀon Block Diagram
Pins 2,4 and 6 must be DC and RF grounded.
BeRex
●website: www.berex.com
●email: sales@berex.com
1
Specificaꢀons and informaꢀon are subject to change and products may be disconꢀnued without noꢀce. BeRex is a trademark of BeRex.
All other trademarks are the property of their respecꢀve owners. © 2010 BeRex
Rev. C