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BCX52-10-115 PDF预览

BCX52-10-115

更新时间: 2024-11-24 12:56:27
品牌 Logo 应用领域
恩智浦 - NXP 晶体晶体管
页数 文件大小 规格书
22页 1121K
描述
PNP medium power transistor series in Surface-Mounted Device (SMD) plastic packages.

BCX52-10-115 数据手册

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BCP52; BCX52; BC52PA  
60 V, 1 A PNP medium power transistors  
Rev. 9 — 18 October 2011  
Product data sheet  
1. Product profile  
1.1 General description  
PNP medium power transistor series in Surface-Mounted Device (SMD) plastic packages.  
Table 1. Product overview  
Type number[1]  
Package  
NXP  
NPN complement  
JEITA  
SC-73  
SC-62  
-
JEDEC  
BCP52  
BCX52  
BC52PA  
SOT223  
SOT89  
SOT1061  
-
BCP55  
BCX55  
BC55PA  
TO-243  
-
[1] Valid for all available selection groups.  
1.2 Features and benefits  
High current  
Three current gain selections  
High power dissipation capability  
Exposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061)  
Leadless very small SMD plastic package with medium power capability (SOT1061)  
AEC-Q101 qualified  
1.3 Applications  
Linear voltage regulators  
High-side switches  
Battery-driven devices  
Power management  
MOSFET drivers  
Amplifiers  
1.4 Quick reference data  
Table 2.  
Quick reference data  
Symbol Parameter  
Conditions  
Min  
Typ  
Max  
60  
1  
Unit  
V
VCEO  
IC  
collector-emitter voltage open base  
collector current  
-
-
-
-
-
-
A
ICM  
peak collector current  
single pulse; tp 1 ms  
2  
A

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