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BCP68T3 PDF预览

BCP68T3

更新时间: 2024-11-08 23:34:55
品牌 Logo 应用领域
其他 - ETC 晶体晶体管
页数 文件大小 规格书
8页 75K
描述
TRANSISTOR | BJT | NPN | 20V V(BR)CEO | 1A I(C) | SOT-223

BCP68T3 数据手册

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ON Semiconductort  
BCP68T1  
NPN Silicon  
Epitaxial Transistor  
ON Semiconductor Preferred Device  
MEDIUM POWER  
NPN SILICON  
HIGH CURRENT  
TRANSISTOR  
This NPN Silicon Epitaxial Transistor is designed for use in low  
voltage, high current applications. The device is housed in the  
SOT-223 package, which is designed for medium power surface  
mount applications.  
SURFACE MOUNT  
High Current: I = 1.0 Amp  
C
The SOT-223 Package can be soldered using wave or reflow.  
SOT-223 package ensures level mounting, resulting in improved  
thermal conduction, and allows visual inspection of soldered joints.  
The formed leads absorb thermal stress during soldering, eliminating  
the possibility of damage to the die  
4
1
2
3
Available in 12 mm Tape and Reel  
CASE 318E-04, STYLE 1  
TO-261AA  
Use BCP68T1 to order the 7 inch/1000 unit reel.  
Use BCP68T3 to order the 13 inch/4000 unit reel.  
The PNP Complement is BCP69T1  
COLLECTOR 2,4  
BASE  
1
EMITTER 3  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Rating  
Collector-Emitter Voltage  
Collector-Base Voltage  
Symbol  
Value  
25  
20  
5
Unit  
Vdc  
Vdc  
Vdc  
Adc  
V
CEO  
V
CBO  
V
EBO  
Emitter-Base Voltage  
Collector Current  
I
C
1
(1)  
Total Power Dissipation @ T = 25°C  
Derate above 25°C  
P
D
1.5  
12  
Watts  
mW/°C  
A
Operating and Storage Temperature Range  
DEVICE MARKING  
T , T  
–65 to 150  
°C  
J
stg  
CA  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
Unit  
Thermal Resistance — Junction-to-Ambient (surface mounted)  
R
83.3  
°C/W  
θJA  
Maximum Temperature for Soldering Purposes  
Time in Solder Bath  
T
L
260  
10  
°C  
Sec  
1. Device mounted on a FR-4 glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.0625 in.; mounting pad for the collector lead = 0.93 sq. in.  
Preferred devices are ON Semiconductor recommended choices for future use and best overall value.  
Semiconductor Components Industries, LLC, 2001  
1
Publication Order Number:  
November, 2001 – Rev. 3  
BCP68T1/D  

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