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BC556BZL1G PDF预览

BC556BZL1G

更新时间: 2024-11-04 03:23:39
品牌 Logo 应用领域
安森美 - ONSEMI 晶体放大器晶体管
页数 文件大小 规格书
7页 78K
描述
Amplifier Transistors PNP Silicon

BC556BZL1G 数据手册

 浏览型号BC556BZL1G的Datasheet PDF文件第2页浏览型号BC556BZL1G的Datasheet PDF文件第3页浏览型号BC556BZL1G的Datasheet PDF文件第4页浏览型号BC556BZL1G的Datasheet PDF文件第5页浏览型号BC556BZL1G的Datasheet PDF文件第6页浏览型号BC556BZL1G的Datasheet PDF文件第7页 
BC556B, BC557A, B, C,  
BC558B, C  
Amplifier Transistors  
PNP Silicon  
http://onsemi.com  
Features  
Pb−Free Packages are Available*  
COLLECTOR  
1
MAXIMUM RATINGS  
2
BASE  
Rating  
Symbol  
Value  
Unit  
Collector - Emitter Voltage  
V
CEO  
V
CBO  
V
EBO  
Vdc  
3
BC556  
BC557  
BC558  
−65  
−45  
−30  
EMITTER  
Collector - Base Voltage  
Emitter - Base Voltage  
Vdc  
BC556  
BC557  
BC558  
−80  
−50  
−30  
−5.0  
Vdc  
TO−92  
CASE 29  
STYLE 17  
Collector Current − Continuous  
Collector Current − Peak  
I
−100  
−200  
mAdc  
C
I
I
1
CM  
2
3
Base Current − Peak  
−200  
mAdc  
BM  
Total Device Dissipation @ T = 25°C  
Derate above 25°C  
P
625  
5.0  
mW  
mW/°C  
A
D
D
Total Device Dissipation @ T = 25°C  
P
1.5  
12  
W
mW/°C  
C
MARKING DIAGRAM  
Derate above 25°C  
Operating and Storage Junction  
Temperature Range  
T , T  
−55 to +150  
°C  
J
stg  
THERMAL CHARACTERISTICS  
Characteristic  
BC  
55xx  
AYWW G  
G
Symbol  
Max  
Unit  
Thermal Resistance,  
Junction−to−Ambient  
R
200  
°C/W  
q
JA  
Thermal Resistance,  
Junction−to−Case  
R
83.3  
°C/W  
q
JC  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
BC55x = Device Code  
x = 6, 7, or 8  
A
= Assembly Location  
Y
= Year  
WW  
G
= Work Week  
= Pb−Free Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 6 of this data sheet.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
September, 2005 − Rev. 2  
BC556B/D  

BC556BZL1G 替代型号

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